X-band TR module for radar and wireless communication systems

Nguyen, Phat T.; Phan, Lam Huynh; Nguyen, Tuan Manh; Tran, Van-Su; Huynh, Cuong

doi:10.1109/atc.2015.7388316

Cited by 3 publications

(2 citation statements)

References 4 publications

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“…On the other hand, the T/R module connects the antenna unit and the frequencyconversion module, performing RF signal amplification and T/R switching functions. In traditional modules with metal package, printed circuit board (PCB) technology is typically applied for multi-chip interconnection, and a metal shell with SMA or SMP connectors and metal baffles inside is used for module encapsulation and isolations [1][2][3][4][5][6][7][8][9]. Due to its large dimensions, it is not conducive to system integration.…”

Section: Introductionmentioning

confidence: 99%

A compact 2-18GHz ultra-wideband frequency-conversion T/R module based on a 3D heterogeneous integrated process

Sun,

Dang,

Zhang

et al. 2024

IEICE Electron. Express

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In this letter, a compact 2-18GHz ultra-wideband frequencyconversion transmit/receive (T/R) module based on a three-dimensional heterogeneous integration (3DHI) process is designed and fabricated. An ultra-wideband impedance matching method is introduced to address the structural discontinuities within the 3D interconnections. Through silicon via (TSV) shielding and cavity designs are leveraged to reduce the impact of local oscillator (LO) leakage. The compact module consists of stacked four-layer silicon interposers and two-layer embedded chips is employed by a 3DHI process with wafer-to-wafer (W2W) bonding, the dimensions of which is only 10.1mm×10.1mm×1.0mm. The measured results show that the saturated output power reaches 19dBm at 2GHz and 16.9dBm at 18GHz, and the rejection of image frequencies exceeds 70dBc.

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Section: Introductionmentioning

confidence: 99%

A compact 2-18GHz ultra-wideband frequency-conversion T/R module based on a 3D heterogeneous integrated process

Sun,

Dang,

Zhang

et al. 2024

IEICE Electron. Express

View full text Add to dashboard Cite

show abstract

“…are made quite easier for microwave circuit designing. [5] In contrast, hybrid MIC circuits using discrete components and distributed elements occupy more area and dissipate more power. However, hybrid MIC technologies provide a shorter design time, capabilities of customization and fine tune of fabricated circuits.…”

Section: Introductionmentioning

confidence: 99%