2008 IEEE MTT-S International Microwave Symposium Digest 2008
DOI: 10.1109/mwsym.2008.4633166
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X-Band 14W high efficiency internally-matched HFET

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Cited by 6 publications
(3 citation statements)
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“…6. It is designed as an output impedance-matching network of an X-band PA, where a four-cell transistor chip [13] is assumed to be die-bonded on a metal plate and wire-bonded to the microstripline circuit on a ceramic substrate, as in the same manner as [2]. These die-and wire-bonding techniques can also be employed to realise the 'through' and 'line' configuration in Fig.…”
Section: Dut and Its Estimation Of Reflection/transmission Characterimentioning
confidence: 99%
See 1 more Smart Citation
“…6. It is designed as an output impedance-matching network of an X-band PA, where a four-cell transistor chip [13] is assumed to be die-bonded on a metal plate and wire-bonded to the microstripline circuit on a ceramic substrate, as in the same manner as [2]. These die-and wire-bonding techniques can also be employed to realise the 'through' and 'line' configuration in Fig.…”
Section: Dut and Its Estimation Of Reflection/transmission Characterimentioning
confidence: 99%
“…A major application of the N-way power-combining network mentioned above is microwave power amplifier (PA). A PA consists of a multi-cell transistor and its N-way input and output impedance-matching (power-dividing/combining) networks [2], and is mainly characterised by its gain, output power, and efficiency. Here, it should be emphasised that these metrics heavily depend on the transmission loss and input impedance of the N-way impedance-matching network.…”
Section: Introductionmentioning
confidence: 99%
“…This results in degraded power performance, rather than an optimized output power. Several design techniques are studied and published to resolve this problem [10,11,12,13].…”
Section: Power Amplifier Designmentioning
confidence: 99%