Transient liquid phase (TLP) bonding [1] is widely used in the aerospace industry for both initial fabrication and pre-and post-service repairs. TLP bonding is derived from high-temperature brazing [2]. However, unlike conventional brazing, extensive diffusion of bond-line and/or substrate constituents is allowed to occur during bonding. This induces compositional changes at the bond-line, which in turn raise the melting temperature of the interlayer used to form the bond. Thus, TLP bonds undergo isothermal re-solidification at the bonding temperature. If a suitable post-isothermal-solidification homogenization treatment is applied, the remelt-temperature, microstructure and hence properties of TLP bonded components can match those of the parent materials. Given that TLP bonding is conducted under isothermal conditions, well below the melting temperature of the substrates and can reproduce parent-metal microstructures, this process is well suited to the joining of damage-sensitive materials, with carefully tailored microstructures, such as structural intermetallic compounds.