Plasma Etching 1989
DOI: 10.1016/b978-0-08-092446-5.50009-3
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WITHDRAWN: Diagnostics of Plasmas for Materials Processing

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Cited by 31 publications
(41 citation statements)
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“…The sintered colloidal crystals were then exposed to HNB of oxygen gas for the partial etching of PS microspheres. In doing this, the energetic neutral oxygen gas collides with PS microspheres and reacts with the hydrophobic surfaces to generate gaseous H 2 O, CO, or CO 2 leaving behind the partially etched particles, each connected with twelve nearest neighbors through very thin cylinders . The etching chamber was operated at 80 mTorr of oxygen pressure for given etching time intervals.…”
Section: Resultsmentioning
confidence: 99%
“…The sintered colloidal crystals were then exposed to HNB of oxygen gas for the partial etching of PS microspheres. In doing this, the energetic neutral oxygen gas collides with PS microspheres and reacts with the hydrophobic surfaces to generate gaseous H 2 O, CO, or CO 2 leaving behind the partially etched particles, each connected with twelve nearest neighbors through very thin cylinders . The etching chamber was operated at 80 mTorr of oxygen pressure for given etching time intervals.…”
Section: Resultsmentioning
confidence: 99%
“…[1][2][3] They are used to protect the ceramic parts inside etchers or chemical vapor deposition reactor chambers from corrosion caused by fluorocarbon corrosive gases such as CF 4 , C 2 F 6 , and Cl 2 . [4][5][6][7] These oxide ceramic coating materials easily interact with plasma and erode, resulting in particles that may contaminate the wafer and further affect the etching product. 8) To overcome this problem, yttrium-based ceramic materials are currently produced using atmospheric plasma spraying (APS) coatings as plasma-facing wall materials owing to their high thermal shock resistance and low etch rates, thus significantly increasing the lifetime of the ceramic parts.…”
Section: Introductionmentioning
confidence: 99%
“…The purpose of this article is to review the microwave interferometry data obtained from the GEC reactor to date [ 4 6 ], including a description of the measurement methods and equipment. The latter will be briefly presented in the next section on the basic equations and equipment for the sake of completeness; but, several excellent chapters [ 3 , 7 – 10 ] and texts [ 11 , 12 ] on microwave diagnostic techniques convey both more general and in depth information which is not presented here. In the final section, representative data from plasmas through argon, helium, nitrogen and carbon tetrafluoride in the GEC reactor are given as a function of the rf current and time.…”
Section: Introductionmentioning
confidence: 99%