Wirkungen der inhibitoren bei der elektrokristallisation

Fischer, H.

doi:10.1016/0013-4686(60)87006-5

Cited by 60 publications

(8 citation statements)

References 37 publications

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“…It is known that the presence of impurities influences greatly both the type of morphology obtained in metal electrodeposition and also the kinetic parameters (2)(3)(4)(5). For example, the presence of 10 -s mole liter -1 of n-decylamine was found (3) to be effective in preventing a full development of pyramids on the (100) face of copper single crystals; and 10 -7 mole liter -1 completely prevented their formation.…”

mentioning

confidence: 99%

The Electrocrystallization of Zinc Dendrites in High-Purity, and Inhibitor Doped, Alkaline Zincate Solutions

Diggle

Damjanović²

1970

J. Electrochem. Soc.

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The influence of electrolyte purity on the initiation times and propagation rates of zinc dendrites grown in alkaline zincate solution is examined. No significant difference was found to exist between the results obtained in the present high‐purity systems and those reported previously for the unpurified system. It is proposed that this is due to the fact that the zinc deposition potential is so far removed from the pzc of zinc that the electrode coverage with impurities present in unpurified solutions is far below that known to affect both morphology and kinetics. Evidence supporting this view was obtained in the case of benzene‐doped zincate solutions, where 10−4 mole liter−1 benzene did not affect the growth of dendrites. Lead and organic cation‐doped zincate solutions were found to be effective in retarding dendrite initiation, the degree of retardation depending on their concentration.

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mentioning

confidence: 99%

The Electrocrystallization of Zinc Dendrites in High-Purity, and Inhibitor Doped, Alkaline Zincate Solutions

Diggle

Damjanović²

1970

J. Electrochem. Soc.

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“…Comparison of the images obtained one day after deposition clearly shows that cross-sectional structures were different for the deposits obtained from the different baths. According to Fischer's classification [67], the deposit from the Cl-PEG-SPS bath (Fig. 13.9c) is regarded as an "unoriented dispersion (UD)"-type deposit.…”

Section: Crystallographic Analysis Of Copper Electrodepositsmentioning

confidence: 99%

Electrochemical Deposition Process for ULSI Interconnection Devices

Osaka

Yoshino

2010

Modern Electroplating

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“…[53, 59 to 61]) and which can be categorized in various ways according to chemical nature, mode of action and selectivity. Some of the proposed mechanisms according to Franklin [61] include surface blocking mechanisms [53,62] (strongly adsorbing additives with hydroxyl, thiol, disulfide and thioether groups [63]); changes in the potential drop across the double layer (caused by ionic additives); complex formation (by complexing agents), thereby lowering the concentration of the ion and causing a shift in the Nernst potential; enhanced adsorption of the complexed ion or introduction of a bridging ligand [64]; ion pairing [65] (synergistic effect, for example using a quarternary salt); changes in interfacial tension (surfactants) and film formation on the electrode; formation of insoluble films on the electrode surface.…”

Section: Cu Deposition In the Presence Of Plating Additivesmentioning

confidence: 99%