Abstract:To realize an uniformization of wiring thickness on a large size silicon probe, a design of wiring to supply current and electroplating conditions were analytically and experimentally evaluated. Circuit simulations adopted with nonlinear resistance elements clarified the distribution of current density on silicon probes. The voltage drop of current
supply wiring on the silicon probe was necessary to be decreased to uniformize the thickness of wirings. Thus, the resistance of current
supply wiring was decreas… Show more
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