Wire Bonding Using Pd Plated Cu Wire

Onodera, Masanori; Shinma, Yasuhiro; Meguro, Kouichi; Tanaka, Junji; Kasai, Junichi

doi:10.5104/jiep.11.444

Cited by 7 publications

(3 citation statements)

References 7 publications

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“…The preparation methods of cladding composite materials include coating [14], cladding extrusion [15][16][17], continuous core-filling casting [18][19][20], plating [21], cladding drawing [22] and rotary swaging [23][24][25]. The cladding drawing is one of the main methods for preparing high-quality cladding composite materials in small batches, which has the advantages of a uniform and controllable coating, density and strong interfacial adhesion.…”

Section: Introductionmentioning

confidence: 99%

Optimization of the First-Step Drawing Parameters for Platinum-Clad Nickel Bar Based on FEM Simulation

Chen

Chong

Zhao

et al. 2023

Metals

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The first-step drawing process of the platinum-clad nickel composite bar was numerically simulated using DEFORM 3D finite element analysis software. The Taguchi method was used to study the effect of the first-step drawing parameters (the semi-angle of die α, the friction coefficient between the platinum tube and die μ1, the friction coefficient between the platinum tube and nickel rod μ2 and the outer diameter of the original platinum tube D) on the effective stress of platinum-clad nickel bar. Then, the optimal combination of parameters (D = 7.55 mm, μ1 = 0.2, μ2 = 0.3, α = 3°) was obtained. Furthermore, the results of the deformation behavior, cladding behavior, stress effectiveness and the distribution of the damage of the composite bar using optimization schemes were compared and analyzed with Numerical Simulations 8, which showed the worst result. Meanwhile, the experimental results were in general agreement with the simulation results of optimal combination of parameters, indicating that our simulation results are plausible. This has certain guidance significance to improve the quality of platinum-clad nickel composite wires in actual production.

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Section: Introductionmentioning

confidence: 99%

Optimization of the First-Step Drawing Parameters for Platinum-Clad Nickel Bar Based on FEM Simulation

Chen

Chong

Zhao

et al. 2023

Metals

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“…A surface oxide film on copper does not exist stably; therefore, palladium-coated Cu wires are used and a stable joining quality is achieved [37,38]. Because of copper's hardness, the ultrasonic power and substrate temperature of Cu bonding needs to be higher than those of Au or Al bonding.…”

Section: Introductionmentioning

confidence: 99%

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Takahashi

Fukuda

Yoneshima

et al. 2017

Journal of Electronic Packaging

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Low-temperature microjoining, such as wire (or ribbon) bonding, tape automated bonding (TAB), and flip chip bonding (FCB), is necessary for electronics packaging. Each type of microjoining takes on various aspects but has common bonding mechanisms regarding friction slip, plastic deformation, and friction heating. In the present paper, solid-state microjoining mechanisms in Au wire (ball) bonding, FCB, Al wire bonding (WB), and Al ribbon bonding are discussed to systematically understand the common bonding mechanisms. Ultrasonic vibration enhances friction slip and plastic deformation, making it possible to rapidly obtain dry interconnects. Metallic adhesion at the central area of the bonding interface is mainly produced by the friction slip. On the other hand, the folding of the lateral side surfaces of the Au bump, Au ball, and Al wire is very important for increasing the bonded area. The central and peripheral adhesions are achieved by a slip-and-fold mechanism. The solid-state microjoining mechanisms of WB and FCB are discussed based on experimental results.

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“…[5] In this process, nitrogen gas can be used as a non-oxidizing gas during ball formation. Pd-coated copper wire bonding on a sintered film of SNP was…”

Section: Bonding Pad Fabrication In Ink-jet Printing Using Silver Nanmentioning

confidence: 99%

Bonding Pad Fabrication for Printed Electronics Using Silver Nanoparticles

Nakatani

Nakajo

Saitô

et al. 2013

Transactions of The Japan Institute of Electronics Packaging

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Silver nanoparticle paste (SNP) was demonstrated to be a promising candidate as an alternative material to conventional silver electro-plating. The sintered film of SNP in a reductive atmosphere showed excellent bonding strength equivalent to the value of the silver electro-plated surface in gold and copper wire bonding. The silver hybrid paste (SHP) composed of micro and nanoparticles has been newly developed. SHP with 40 μm thickness exhibited low volume resistivity after sintering. The sintered film showed good wire bondability.

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Wire Bonding Using Pd Plated Cu Wire

Cited by 7 publications

References 7 publications

Optimization of the First-Step Drawing Parameters for Platinum-Clad Nickel Bar Based on FEM Simulation

Optimization of the First-Step Drawing Parameters for Platinum-Clad Nickel Bar Based on FEM Simulation

Solid-State Microjoining Mechanisms of Wire Bonding and Flip Chip Bonding

Bonding Pad Fabrication for Printed Electronics Using Silver Nanoparticles

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