Wire-bond electrical connections :

Abstract

More than 245 papers relevant to wire-bond type electrical interconnections used in microelectronic and low-power discrete and hybrid devices are listed together with key words. The bibliographic search concentrated on compiling papers which appeared in the period from 1965 to 1970, inclusive.The selection of papers was generally limited to those that were pertinent to wire bonds where the wire diameter is less than about 50 urn (2 mils) and where the wire is bonded by either thermocompressive or ultrasonic means. Two indexes are provided: (1) an Author Index and (2) a Key Word Index. The latter includes a tabulation of the literature citations.Key Words: bibliography; degradation (wire bond); discrete devices; electrical interconnection; fabrication (wire bond); failure (wire bond); hybrid circuits, integrated circuits; microelectronics; reliability; testing (wire bond); wire bond.1. IntroductionSmall-diameter (< 50 ym) wire is the government reports, U. S. patents, and conprincipal means of making electrical connectference presentations relevant to wire bonds ions (1) between the semiconductor die and in these three subject areas of testing, fabthe terminals leading outside the package of rication, and degradation, microelectronic and low-power discrete and hybrid devices, and (2) between differentThe 6 <lLo.cJU.on ofa papeAA is generally dice on a single device header of hybrid cirlimited to those that are pertinent to wire cuits. This o£<LcAKiojxl sLYVtQAC.onnzcJU.on. or bonds that have wire diameters of less than uxuiz-bond,* as it will be referred to here, about 50 urn (2 mils) and are bonded by either is considered to be the wire between two thermocompressive or ultrasonic means. This bonded points, the bonds, the bonding suris the class of wire bonds that is of most face films, and the underlying material in interest in microelectronics. An attempt the immediate vicinity of the bonds. FcUMlAd was made to make the collection of papers on of a wire bond is one of the principal failtest and evaluation methods complete while ure modes in these devices. As a result, the collection of articles in the area of great importance has been attached to the fabrication and degradation is meant to be following three subject areas: (1) methods representative. Some interesting papers for testing and evaluating wire bonds, (2) could not be included because of restrictions optimization of the fabrication processes for on their distribution. It is quite possible making wire bonds, and (3) mechanisms of degthat some papers which should have been inradation and failure of wire bonds. eluded were overlooked. The compiler would appreciate having such omissions called to ( This bibliography is a comp-ltcutlon of his attention. more than 245 published articles, U. S. AcknowledgementThe author is pleased to acknowledge the significant contributions made by Elaine C W.Cohen who assisted in collecting much of the material and performed both expeditiously and cheerfully many of the tedious labors that the compilation o...