Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?

Tiedje, Tobias; Lungen, Sebastian; Schubert, M.; Luniak, Marco; Nieweglowski, Krzysztof; Bock, Karlheinz

doi:10.1109/ectc.2017.276

Cited by 8 publications

(3 citation statements)

References 1 publication

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“…Another important advantage of using AM is the ability to fabricate different kinds of materials such as metals [ 3 ], insulators [ 4 ], semiconductors [ 5 ], ceramics [ 6 ], and polymers [ 7 ]. In addition, AM is expected to play a significant role in semiconductor chip packaging [ 8 ] and metal interconnects [ 3 ]. As reported by Callen Votzke et al, 3D printed, metal-based interconnects show stable conductivity for 350 cycles of strain test [ 9 ].…”

Section: Introductionmentioning

confidence: 99%

A Comprehensive Review on Printed Electronics: A Technology Drift towards a Sustainable Future

Chandrasekaran¹,

Jayakumar

Velu

2022

Nanomaterials

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Printable electronics is emerging as one of the fast-growing engineering fields with a higher degree of customization and reliability. Ironically, sustainable printing technology is essential because of the minimal waste to the environment. To move forward, we need to harness the fabrication technology with the potential to support traditional process. In this review, we have systematically discussed in detail the various manufacturing materials and processing technologies. The selection criteria for the assessment are conducted systematically on the manuscript published in the last 10 years (2012–2022) in peer-reviewed journals. We have discussed the various kinds of printable ink which are used for fabrication based on nanoparticles, nanosheets, nanowires, molecular formulation, and resin. The printing methods and technologies used for printing for each technology are also reviewed in detail. Despite the major development in printing technology some critical challenges needed to be addressed and critically assessed. One such challenge is the coffee ring effect, the possible methods to reduce the effect on modulating the ink environmental condition are also indicated. Finally, a summary of printable electronics for various applications across the diverse industrial manufacturing sector is presented.

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Section: Introductionmentioning

confidence: 99%

A Comprehensive Review on Printed Electronics: A Technology Drift towards a Sustainable Future

Chandrasekaran¹,

Jayakumar

Velu

2022

Nanomaterials

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“…1b). Some similar methodologic explorations [26,27] have used this direct bonding method to evaluate whether low-cost 3D-printed packaging could replace the fan-out wafer-level packages. However, the high-CTE resin used thus far (87.5 ppm/ • C) does not yet suit applications with many and high-temperature cycles.…”

Section: Introductionmentioning

confidence: 99%

Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards

Fei

Nie

Zhong

et al. 2022

Materials Today Communications

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“…Due to the recent developments in additive manufacturing or 3D printing, its fabrication capabilities are reaching the required dimensions for electronic packaging. Therefore, 3D printing or additive manufacturing is generating a lot of attention in the packaging community for applications such as MEMS packaging [6], transmission lines [7], antennas [8], and fan-out wafer level packaging (FOWLP) [9,10]. Due to the advantages of low cost fabrication and the capability to create complex geometries, 3D printing has the potential to be used to fabricate cost efficient polymer impingement coolers.…”

Section: Introductionmentioning

confidence: 99%

3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges

Wei

Oprins

Cherman

et al. 2018

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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Liquid jet impingement cooling is a very efficient cooling technology for high performance devices. Previous studies demonstrated that polymers can be used as a cost effective alternative for Si for the fabrication of impingement coolers. The recent developments in additive manufacturing or 3D printing technology enable the potential to fabricate low cost polymer coolers with complex internal channels. In this paper, the use of 3D printing is discussed for the fabrication of a chip level polymer impingement cooler. The paper presents the cooler design, the manufacturability aspects and the characterization of several 3D printed coolers with different nozzles arrays. The challenges and opportunities for the use of 3D printing for this applications are discussed. A methodology to provide design guidelines for 3D printed liquid impingement jet coolers is elaborated.

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Will Low-Cost 3D Additive Manufactured Packaging Replace the Fan-Out Wafer Level Packages?

Cited by 8 publications

References 1 publication

A Comprehensive Review on Printed Electronics: A Technology Drift towards a Sustainable Future

A Comprehensive Review on Printed Electronics: A Technology Drift towards a Sustainable Future

Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards

3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges

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