2017
DOI: 10.1109/tcpmt.2017.2658669
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Wideband Filtering Balun on a Novel Hybrid Multimode Resonator With the Functionality of Vertical Transition

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Cited by 32 publications
(17 citation statements)
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“…According to equations (19)- (22), (34)- (37), (50)- (53), and (66)-(69), the power-division ratios k and terminated resistances R A,B,C,D can be arbitrary. However, in practical, the implemented power-division ratios and terminated resistances are limited by the used technology.…”
Section: A the Restrictions Of Power-division Ratio And Terminated Rmentioning
confidence: 99%
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“…According to equations (19)- (22), (34)- (37), (50)- (53), and (66)-(69), the power-division ratios k and terminated resistances R A,B,C,D can be arbitrary. However, in practical, the implemented power-division ratios and terminated resistances are limited by the used technology.…”
Section: A the Restrictions Of Power-division Ratio And Terminated Rmentioning
confidence: 99%
“…For example, 5-port power dividers with an unbalanced input and balanced outputs are proposed in [11], [12], and 4-port power dividers with a balanced input and unbalanced outputs are reported in [13]- [15]. In addition to power dividers, balanced-to-unbalanced (or vice versa) duplexers and filters (also known as the filtering balun) are also presented in [16] and [17]- [19], respectively. Nevertheless, couplers with balanced and unbalanced ports are still untouched, including both the quadrature and rat-race types.…”
mentioning
confidence: 99%
“…There are mainly two methods for design of the MS‐to‐MS vertical transition, namely, vertical via‐hole transition with electrical connection and vialess vertical transition. Over the past few years, extensive research works have been devoted to developing various MS‐to‐MS vialess vertical transitions 1‐17 . For the first method, the via‐hole transitions with electrical connection, 1‐4 and for the second method, such as aperture‐coupled transitions, 5,6 cavity‐coupled transitions, 7‐10 and slotline coupled transitions 11‐17 have been utilized for designing the MS‐to‐MS vialess vertical transition.…”
Section: Introductionmentioning
confidence: 99%
“…Vertical transition applications were also exemplified in a wideband balun [37], in the study of the parasitic element of interchip vertical interconnection [38], in a failure analysis of TSV in 3D IC [39], and in a proposed bond via array method using wire bonding [40].…”
Section: Introductionmentioning
confidence: 99%