Whole-field thickness strain measurement using multiple camera digital image correlation system

Li, Junrui; Xie, Xin; Yang, Guobiao; Zhang, Boyang; Siebert, Thorsten; Yang, Lianxiang

doi:10.1016/j.optlaseng.2016.09.012

Cited by 91 publications

(24 citation statements)

References 21 publications

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“…The basic principle of DIC operation is that after collecting the images during the application of the various loads, a comparison of the images is made following what happens with the points of random pattern divided into several subgroups compared to the image in which the surface is undeformed, Fig. 1, [26][27][28][29]. The displacements measured by DIC represent the displacement vectors corresponding to displacements of all subsets centers.…”

Section: Digital Image Correlation (Dic)mentioning

confidence: 99%

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Marșavina

Falk

Pop

2019

Frattura Ed Integrità Strutturale

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This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA-Ball grid arrays (BGA). Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of images taken during test. The experimental setup is realized with Dantec Q-400 system used for image capture and Istra 4D software for image correlations and data analyses. The maximum level of the obtained strain is compared with the allowable limit. Finite element analysis (FEA) is a numerical method of analysis for stresses and strain in structures of any given geometry.

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Section: Digital Image Correlation (Dic)mentioning

confidence: 99%

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Marșavina

Falk

Pop

2019

Frattura Ed Integrità Strutturale

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“…The use of images obtained from digital video cameras can be considered as a non-contact approach in structural measurements [4][5][6][7]. Optical measurement methods such as digital image correlation (DIC) and point tracking (PT) have been utilised to perform modal analysis on large-scale industrial structures [8][9][10][11]. The DIC and PT methods provide smooth mode shapes with high accuracy.…”

Section: Introductionmentioning

confidence: 99%

Manifestation of Flexural Vibration Modes of Rails by the Phase-Based Magnification Method

et al. 2021

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With the recent development of high performance photography devices, vibration measurements using digital image processing can be utilised for the condition monitoring and the analysis of generation mechanisms. High-quality image recording provides very dense spatial information unlike physical sensors with a limited number of point-oriented measurements and output channels such as accelerometers. Moreover, image acquisition is a non-contact technique and ensures that the installed sensors do not affect the mass or stiffness. In this study, the vibration mode of rails is investigated using the phase-based video magnification method. An extensive amount of information that cannot be detected by human eyes, can be obtained with this imaging motion magnification technique by amplifying and visualising the minute vibrational movements. Flexural vibration modes in rails generate rolling noise, especially at high frequencies where the displacement amplitudes are small. The motion magnification method is applied using a high-speed camera to measure the rail mode shapes. The measured mode shapes are compared to the numerical results obtained from the waveguide finite element method. This method helps in understanding the vibration generation and the transfer mechanisms in the waveguide structures with a uniform cross-section in the lengthwise direction such as a railway track.

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“…Thickness strain measurement at any point on the sheet metal surface using DIC was first reported by our lab at Oakland University together with Dantec-Dynamics GmbH, Germany [19]. This method was based on using multiple multi-camera DIC systems to measure strains in three directions simultaneously.…”

Section: Introductionmentioning

confidence: 99%

A New and Direct R-Value Measurement Method of Sheet Metal Based on Multi-Camera DIC System

Fang

Zheng

et al. 2021

Metals

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More and more attention has been given in the field of mechanical engineering to a material’s R-value, a parameter that characterizes the ability of sheet metal to resist thickness strain. Conventional methods used to determine R-value are based on experiments and an assumption of constant volume. Because the thickness strain cannot be directly measured, the R-value is currently determined using experimentally measured strains in the width, and loading directions in combination with the constant volume assumption, to determine the thickness strain indirectly. This paper provides an alternative method for determining the R-value without any assumptions. This method is based on the use of a multi-camera DIC system to measure strains in three directions simultaneously. Two sets of stereo-vision DIC measurement systems, each comprised of two GigE cameras, are placed on the front and back sides of the sample. Use of the double-sided calibration strategy unifies the world coordinate system of the front and back DIC measurement systems to one coordinate system, allowing for the measurement of thickness strain and direct calculation of R-value. The Random Sample Consensus (RANSAC) algorithm is used to eliminate noise in the thickness strain data, resulting in a more accurate R-value measurement.

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Whole-field thickness strain measurement using multiple camera digital image correlation system

Cited by 91 publications

References 21 publications

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation

Manifestation of Flexural Vibration Modes of Rails by the Phase-Based Magnification Method

A New and Direct R-Value Measurement Method of Sheet Metal Based on Multi-Camera DIC System

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