2020
DOI: 10.1016/j.apsusc.2019.144127
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Wetting properties, recrystallization phenomena and interfacial reactions between laser treated Cu substrate and SAC305 solder

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Cited by 19 publications
(8 citation statements)
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References 13 publications
(18 reference statements)
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“…The lead-free solder used in this study is SAC 305, with the compositions of 96.5% tin, 3% silver and 0.5% copper [10]. At the room temperature, SAC 305 solder is a solid, and it liquified after reaching its melting temperature.…”
Section: Methodsmentioning
confidence: 99%
“…The lead-free solder used in this study is SAC 305, with the compositions of 96.5% tin, 3% silver and 0.5% copper [10]. At the room temperature, SAC 305 solder is a solid, and it liquified after reaching its melting temperature.…”
Section: Methodsmentioning
confidence: 99%
“…The locations of these zones are illustrated in figure 2. [5] [6] [7]. [8] During the welding of mixed joints, the formation of intermetallic compounds is a common phenomenon, which impairs the properties of the joint.…”
Section: Figure 1 Principle Of Fsw Process [5]mentioning
confidence: 99%
“…G Béres et al also investigated the SEM. G Béres and Z Weltsch investigated the variation of hardness in dual phase steels with different of the materials under investigation was also important, which was analysed, for example, by XRD or reference to wettability and its characteristics [12] [13]. In their studies, the micro and macro structure Spectral images recorded the frequency as a function of time, while spectrum images plot the amplitude as a function of frequency.…”
Section: Describing the Process Of Recording The Acoustic Spectrummentioning
confidence: 99%