Wetting of TiC by Al–Cu alloys and interfacial characterization

Contreras, A.

doi:10.1016/j.jcis.2007.02.041

Cited by 39 publications

(13 citation statements)

References 28 publications

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“…There is an incubation period of approximate 5 min to form stable Cu 6 Sn 5 layer. This result is consistent with that reported by Contreras and Wan et al [20,21]. At last, when all of the forces reached equilibrium, the contact angle became stable at 53.5° (within±0.3°) in stage IV (Figure 2(i)), and θ L and θ R also became identical.…”

Section: The Contact Angle Between the Molten Sn-ag-cu Alloy And Cu Ssupporting

confidence: 92%

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

et al. 2010

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Wettability of molten Sn-Ag-Cu alloy on Cu substrate has been determined by sessile drop method, as well as its dependence on time and temperature. It was found that the evolution of contact angle at the alloy's melting point experienced four different stages. Especially, the contact angle was unstable and fluctuant in stage II, and gradually decreased in stage III mainly due to a chemical reaction between Sn-Ag-Cu alloy and Cu substrate. The contact angle decreased with increasing temperature, but increased slightly at 629 K, for another chemical reaction occurred. Interfacial characteristic has been further investigated by examining the sample's cross section. Intermetallic compounds of Cu 6 Sn 5 and β-Sn phase were found at the interface of Sn-Ag-Cu/Cu. contact angle, lead-free solder, sessile drop method, Sn-Ag-Cu, intermetallic compounds Citation:Zhang X R, Yuan Z F, Zhao H X, et al. Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate.There have been several regulations to ban Pb from electronic products all over the world. The European Union's RoHS directive is the initial driving force for the elimination of Pb because Pb contained in conventional solder materials has harmful influence on the environment and human health [1−6]. As a result, lead-free solders with microstructure stability and mechanical properties comparable with eutectic Pb-Sn solder stimulate immense interests in microelectronic application. Nowadays several lead-free solders including Sn-Ag, Sn-Cu, Sn-Zn, Sn-Ag-Bi and Sn-Ag-Cu systems have been developed. Among them, the near-ternary eutectic Sn-Ag-Cu system solders have been regarded as primary candidates because of their good mechanical and acceptable wetting properties as well as suitable melting points [7−10]. Wettability has been defined as the tendency for a liquid to spread on a solid surface, and it is optimized by minimizing the value of contact angle, which corresponds to lower surface-interfacial energy. Therefore, the measurement of contact angle between solder and substrate is used to determine the extent of wetting, which is a very important issue in the reliability of electronic packaging. The reported values in the literature on the contact angle for lead-free solder alloys are quite disparate and hard to be compared with each other, mainly due to the different experimental conditions [8,11]. Another issue is the formation and growth of intermetallic compounds (IMCs) between solder and substrate, which is of great importance to the performance of lead-free solders [12].The purpose of this work is to investigate the wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate. Contact angles were measured by sessile drop method, and the morphology of the interface of Sn-Ag-Cu/Cu was also investigated.

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Section: The Contact Angle Between the Molten Sn-ag-cu Alloy And Cu Ssupporting

confidence: 92%

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

et al. 2010

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“…An extensive literature survey is performed for available experimental results [11][12][13][14]. The experimental results are divided in two sets, train and test data sets.…”

Section: Methodsmentioning

confidence: 99%

Effects of Temperature, Time, Magnesium, and Copper on the Wettability of Al/TiC System

Kurt

Oduncuoğlu

2015

Mathematical Problems in Engineering

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The effects of temperature, time, and the additions of magnesium and copper on the wetting behavior of Al/TiC are studied theoretically. Mathematical formula is presented in explicit form. The effect of each variable is investigated by using the obtained equation. It is observed that the time and temperature have a stronger effect on the wetting of TiC in comparison to other input parameters. The proposed model shows good agreement with test results and can be used to find the wetting behavior of Al/TiC. The findings led to a new insight of the wetting process of TiC.

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“…Dissolutive spreading has commonly been studied for metal‐metal systems and mostly at high temperatures. The majority of these studies involve solid surfaces . Limited studies are available on porous surfaces most of which involve reactive wetting instead of dissolutive wetting, while others are related to high temperature applications .…”

Section: Introductionmentioning

confidence: 99%

An investigation on dissolutive wetting of porous urea surface

et al. 2018

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Dissolutive spreading over a porous surface is a phenomenon involving spreading, penetration, as well as dissolution. Droplet spreading forms the basis of numerous industrial operations including the spray coating of urea fertilizer to produce slow release urea. The slow release characteristics of urea highly depend on the coating uniformity that can be achieved by sound knowledge of droplet spreading behaviour over the urea surface. Since numerous waterborne coating materials are being studied presently, dissolutive wetting of the urea surface has been investigated in the current work. Response surface methodology has been utilized to study the interactive effects of process parameters on the dissolutive wetting of an aqueous glycerin solution on a porous urea surface. The effect of impact velocity, surface porosity, and urea solubility has been investigated on three response objectives namely contact angle, spreading factor, and normalized residual drop volume. The results have been compared with an earlier work performed under similar conditions for non-dissolutive wetting. The comparison reveals that dissolutive wetting shows lesser optimum contact angle (81 %) and greater optimum spreading factor (21 %) as compared to non-dissolutive wetting.

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Wetting of TiC by Al–Cu alloys and interfacial characterization

Cited by 39 publications

References 28 publications

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

Effects of Temperature, Time, Magnesium, and Copper on the Wettability of Al/TiC System

An investigation on dissolutive wetting of porous urea surface

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