Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

Huang, Her-Yueh; Yang, Chung-Wei; Pan, Sian-Ze

doi:10.1515/secm-2012-0152

Cited by 3 publications

(3 citation statements)

References 23 publications

(22 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The Cu 6 Sn 5 IMC layer thickness in the as-soldered and thermally aged joints is suppressed with the addition of CNT but the effect was rather weaker than for the other composite solders mentioned earlier [114–116]. According to Nai et al [115], the CNT was in the form of a single-dispersed strand and a CNT cluster after being added into the solder (as shown in figure 11(b)).…”

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 94%

See 1 more Smart Citation

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.

show abstract

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 94%

“…This was evidenced by the discovery of CNTs at the solder fractured surface. Excessive addition of CNTs would reduce the solder wettability as the interaction between solder and substrate elements could be severely blocked by excessive CNTs [113, 114]. …”

Section: Effect Of Nanoparticle Addition On Sac–x/cu Joint Interfacementioning

confidence: 99%

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

show abstract

“…MWCNTs can improve the wettability of composite solders compared with SWCNTs. Huang et al [80] conducted contact angle tests on SAC305 composite solder with MWCNTs added. The results show that the presence of MWCNTs reduces the contact angle of the composite solder and thus improves its wettability.…”

Section: Composite Solder Reinforced With Mwcntsmentioning

confidence: 99%

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Li,

Qin,

Mai

et al. 2023

Crystals

View full text Add to dashboard Cite

Carbon nanotubes (CNTs) are being applied with increasing frequency for advanced soldering. They have excellent mechanical, electrical, and thermal properties and are primarily used to reinforce lead-free solders. This paper discusses the strengthening mechanism of CNTs, introduces the preparation methods of CNT composite solders, and focuses on the review of tin-based lead-free solders reinforced with unmodified CNTs and metal-modified CNTs. The addition of CNTs can effectively improve the ultimate tensile strength, microhardness, shear strength, and creep resistance of the solder. However, the practical application of CNT composite solders has been a challenge for researchers for decades. The most significant issue is uniform dispersion due to the large density and surface differences between CNTs and solders. Other concerns are the structural integrity of CNTs and their limited addition amount, solder wettability, and interfacial bonding. CNT composite solders can only be widely used in a real sense when these challenges are properly addressed and overcome. At present, there is a lack of comprehensive reviews covering the structure, the strengthening mechanism, the preparation method of CNT composite solders, and the influence of CNT types on their strengthening effects. Therefore, this paper aims to fill this gap and contribute to solving the problems faced by the application of CNTs in solder. Future work is expected to focus on improving the dispersion and bonding of CNTs and optimizing the preparation method.

show abstract

Carbon‐Nanotube‐Reinforced Solders as Thermal Interface Materials

Billah

2019

Harsh Environment Electronics

View full text Add to dashboard Cite

Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

Cited by 3 publications

References 23 publications

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review

Carbon‐Nanotube‐Reinforced Solders as Thermal Interface Materials

Contact Info

Product

Resources

About