Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

Ervina, Efzan M.N.; Tan, Shihai

doi:10.4028/www.scientific.net/amm.315.675

Cited by 10 publications

(9 citation statements)

References 27 publications

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“…This correlated with the formation of eutectic Sn-3.5Ag-0.5Cu (SAC) solder by the addition of Cu in the SA solder (Zhang et al, 2012a;Kotadia et al, 2012). Meanwhile, the overall contact angle for Sn-3.1Ag-0.9Cu (SAC) was within 20 to 30°, and the SAC solder showed better wettability at a reflow temperature of 250°C by producing a larger spreading area and lower contact angle (Ervina and Tan, 2013). Although the wettability of the SAC was Ͻ 50°, and this angle was sufficient to produce better joints (Noor et al, 2010), little research has been done based on the wettability of the SAC solder system.…”

Section: Wettability Properties Of Sacmentioning

confidence: 89%

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

Noor

Singh

2014

Soldering &Amp; Surface Mount Technology

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Purpose – The aim of the present study was to gather and review all the important properties of the Sn–Ag–Cu (SAC) solder alloy. The SAC solder alloy has been proposed as the alternative solder to overcome the environmental concern of lead (Pb) solder. Many researchers have studied the SAC solder alloy and found that the properties such as melting temperature, wettability, microstructure and interfacial, together with mechanical properties, are better for the SAC solder than the tin – lead (SnPb) solders. Meanwhile, addition of various elements and nanoparticles seems to produce enhancement on the prior bulk solder alloy as well. These benefits suggest that the SAC solder alloy could be the next alternative solder for the electronic packaging industry. Although many studies have been conducted for this particular solder alloy, a compilation of all these properties regarding the SAC solder alloy is still not available for a review to say. Design/methodology/approach – Soldering is identified as the metallurgical joining method in electronic packaging industry which uses filler metal, or well known as the solder, with a melting point < 425°C (Yoon et al., 2009; Ervina and Marini, 2012). The SAC solder has been developed by many methods and even alloying it with some elements to enhance its properties (Law et al., 2006; Tsao et al., 2010; Wang et al., 2002; Gain et al., 2011). The development toward miniaturization, meanwhile, requires much smaller solder joints and fine-pitch interconnections for microelectronic packaging in electronic devices which demand better solder joint reliability of SAC solder Although many studies have been done based on the SAC solder, a review based on the important characteristics and the fundamental factor involving the SAC solder is still not sufficient. Henceforth, this paper resolves in stating all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding. Findings – Various Pb-free solders have been studied and investigated to overcome the health and environmental concern of the SnPb solder. In terms of the melting temperature, the SAC solder seems to possess a high melting temperature of 227°C than the Pb solder SnPb. Here, the melting temperature of this solder falls within the range of the average reflow temperature in the electronic packaging industry and would not really affect the process of connection. A good amendment here is, this melting temperature can actually be reduced by adding some element such as titanium and zinc. The addition of these elements tends to decrease the melting temperature of the SAC solder alloy to about 3°C. Adding nanoparticles, meanwhile, tend to increase the melting temperature slightly; nonetheless, this increment was not seemed to damage other devices due to the very slight increment and no drastic changes in the solidification temperature. Henceforth, this paper reviews all the properties of the Pb-free SAC solder system by how it is developed from overcoming environmental problem to achieving and sustaining as the viable candidate in the electronic packaging industry. The Pb-free SAC solder can be the alternative to all drawbacks that the traditional SnPb solder possesses and also an upcoming new invention for the future needs. Although many studies have been done in this particular solder, not much information is gathered in a review to give better understanding for SAC solder alloy. In that, this paper reviews and gathers the importance of this SAC solder in the electronic packaging industry and provides information for better knowledge. Originality/value – This paper resolves in stating of all its important properties based on the SAC solder including its alloying of elements and nanoparticles addition for further understanding.

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Section: Wettability Properties Of Sacmentioning

confidence: 89%

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

Noor

Singh

2014

Soldering &Amp; Surface Mount Technology

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“…Moreover, Nousia et al [26], after 45-week storage of milk ice cream enriched with Lactobacillus acidophilus LMGP-21381, also did not notice significant differences from the original values. Ervina et al found that the addition of avocado to non-dairy ice cream reduces the acidity of the product, but no statistically significant differences were found compared to the control sample [15]. This is related to the susceptibility of probiotic bacteria to dying under conditions of too low pH.…”

Section: Discussionmentioning

confidence: 99%

“…The oxidation-reduction potential is an important indicator for monitoring and estimating oxidative changes in the product. In our study, this parameter is of particular importance due to the used raw material-avocado, which mainly contains monounsaturated fatty acids susceptible to oxidation processes [15]. The fact that no significant changes were observed between the values obtained in the 4th and 8th week of freezing storage may indicate the production of metabolites by the used LAB strain that affect the stability of reducing properties during process [28].…”

Section: Discussionmentioning

confidence: 99%

“…There are milk-based ice cream and frozen dairy-free desserts made from soy or coconut vegetable proteins and traditional fruit-based sorbets [13,14]. Avocado paste was also used as a raw material, as a fat substitute in the technology of frozen desserts [15]. As there are few scientific reports on the use of probiotics LAB in ice-cream dessert technology, this research was undertaken.…”

Section: Introductionmentioning

confidence: 99%

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The Use of the Probiotic Lactiplantibacillus plantarum 299v in the Technology of Non-Dairy Ice Cream Based on Avocado

Krawęcka

Libera

Latoch

2021

Foods

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Food enriched with probiotics and prebiotics belong to the class of novel foods. Functional food, apart from its nutritional function, has an additional pro-health effect. The aim of the presented study was to create a concept of a functional dessert—avocado-based non-diary ice cream enriched with probiotic bacteria Lactiplantibacillus plantarum 299v. The product was tested for the survival of bacteria in various conditions, and the influence of the probiotic on the physicochemical and organoleptic properties of non-dairy ice cream was assessed. The dessert with probiotic throughout the storage period (8 weeks) kept the therapeutic minimum defined for probiotic food products. It was found that the addition of the probiotic did not deteriorate either the color or the sensory profile of the dessert. There was also no increase in the redox potential nor the acidity of the product with the addition of a probiotic.

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“…Better wetting occurs when the resultant wetting angle is small. The wetting angle depends on various factors, and these are the PCB finish, the solder alloy, flux, soldering atmosphere, surface roughness, test temperature, solder-substrate interactions and other factors (Ervina et al, 2013). Despite this, accurate determination and repeatability in the measurement of wetting angles has been debated (Sattiraju et al, 2002).…”

Section: Wetting Anglementioning

confidence: 99%

A review: lead free solder and its wettability properties

Noor

Nasir

Idris

2016

SSMT

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Purpose The purpose of this paper is to publish on the review of the lead free solder for electronic packaging. This involved the basic principles of the solder, the lead solder and its legislation and the lead free solder with its mechanism. In addition, this paper also reviews on the lead free solder characteristics that focused on its wettability. Design/methodology/approach This paper approach on the review of the solder wettability on the surface. It reviews on the solder especially on the contact angle and surface tension that is covered under the wettability of the solder. Findings This paper also reviews on the lead free solder characteristics that focused on its wettability. Originality/value This paper summarized finding from other researchers. The authors collect and summarize the useful data from other papers or journals. It is to create an understanding for the reader by discussion from the others research papers findings.

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Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan

Cited by 10 publications

References 27 publications

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

Review on the effect of alloying element and nanoparticle additions on the properties of Sn-Ag-Cu solder alloys

The Use of the Probiotic Lactiplantibacillus plantarum 299v in the Technology of Non-Dairy Ice Cream Based on Avocado

A review: lead free solder and its wettability properties

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