1988
DOI: 10.1016/0025-5416(88)90518-6
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Wettability of hot-pressed silicon nitride materials by liquid copper

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Cited by 14 publications
(5 citation statements)
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“…The non-wetting behaviour and the contact angles of the four ceramic composites with copper and silver are similar as the values found with monolithic Si 3 N 4 by Sangiorgi et al 10 (contact angle value of copper on Si 3 N 4 : about 135 • ), but the equilibrium value obtained between 110 and 130 • probably corresponds to the Cu-Si 3 N 4 -Y 2 O 3 -Al 2 O 3 system. 11 Jungberg and Arren 12 found a contact angle between silver and monolithic Si 3 N 4 of about 155 • .…”
Section: Resultssupporting
confidence: 81%
See 1 more Smart Citation
“…The non-wetting behaviour and the contact angles of the four ceramic composites with copper and silver are similar as the values found with monolithic Si 3 N 4 by Sangiorgi et al 10 (contact angle value of copper on Si 3 N 4 : about 135 • ), but the equilibrium value obtained between 110 and 130 • probably corresponds to the Cu-Si 3 N 4 -Y 2 O 3 -Al 2 O 3 system. 11 Jungberg and Arren 12 found a contact angle between silver and monolithic Si 3 N 4 of about 155 • .…”
Section: Resultssupporting
confidence: 81%
“…10 have shown that the presence of a higher quantity of sintering aids (Y 2 O 3 , Al 2 O 3 ) in the hot pressed composite has no significant influence on the wetting behaviour. On the contrary, it is known that metallic sintering aids as nickel can change the wetting behaviour dramatically.…”
Section: Resultsmentioning
confidence: 96%
“…However, most ductile metals do not wet the most commercially interesting ceramics (e.g., silicon carbide, silicon nitride, aluminum nitride, and alumina) or graphite. [10][11][12][13][14] The addition of a reactive metal, also known as active brazing, results in the reduction of the ceramic phase and formation of new phases at the ceramicmetal interface. [15][16][17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32] Reaction product sequences can become complex, and the resulting structure is often a complicated series of interfacial product layers.…”
Section: Improving Interfacial Propertiesmentioning
confidence: 99%
“…Of the relevant studies worth mentioning are the works of Babini and Vincenzini, 8 Stern,9 Gogotsi et al, 10 Cinibulk and Kleebe 11 and Nickel. 12 Sangiorgi et al 13 and Klein et al 14 separately studied the behaviour of silicon nitride in contact with pure copper in vacuum; a non-wetting behaviour was confirmed in both studies.…”
Section: Introductionmentioning
confidence: 70%