Wettability and Work of Adhesion of Nonreactive Liquid Metals on Silica

Abstract

Wettability of silica by gold, silicon, and lead has been determined by the sessile-drop method. The contact angle, 8, and the work of adhesion, W, have been found to be 143" and 227 mJ . m-* for gold at 1353 K, 87" and 869 mJ . m-' for silicon at 1723 K, and 120" and 203 mJ . m-' for lead at 1000 K.Thermodynamic adhesion between silica and nonreactive pure metals has been analyzed using models for metal-oxide bonds. Models based on the assumption that only van der Waals interactions andlor metal-oxygen chemical bonds exist at the metal-oxide interface are unsuited for explaining the relative variations in the W values. A valid model can be accomplished by using an empirical equation which takes into account both metal-oxygen and metal-oxide chemical bonds. It appears that chemical bonds exist at the interface even for nonreactive metal-ionocovalent oxide systems.

Early-stage oxidation behavior at high temperatures of SiSiC cellular architectures in a porous burner

“…On the other hand, silica while forming expands and squeezes out the molten silicon alloy from the microstructure [25]. The low wettability of the silicon alloy on SiO 2 [33] favors beads formation on the strut's outer surface. These beads then coalesce in larger and larger beads (Fig.…”

Asymmetric silver to oxide adhesion in multilayers deposited on glass by sputtering

“…[15]. General trends have been experimentally identified such as decreasing adhesion with increasing oxide gap [16] or increasing adhesion with increasing enthalpies of mixing [17].…”

Pulsed-laser-induced nanoscale island formation in thin metal-on-oxide films

“…The Ni on SiO 2 system is typically classified as a relatively unreactive pair, 27,28 as Ni, compared to more reactive metals, does not readily form an oxide ͑the heat of formation of the oxide is −241 kJ mol −1 ͒. The melting point of Ni, of 1728 K, is also intermediate between the very high and very low melting point metals.…”