Wet-process preparation of nickel-based photoanode for TCO-less fiber-shaped dye-sensitized solar cells

Continuous wet-process growth of ZnO nanoarrays for wire-shaped photoanode of dye-sensitized solar cell

“…As is previously reported, the energy level and redox potential of Cu is not suitable for applications in DSSC [21,25]. Therefore, Ni was then electroplated on the polymernCu wire from an aqueous NiSO 4 solution (0.76 M) [25,26]. After cleaning with deionized water and drying, a layer of ZnO nanoseeds was deposited on the Ni-plated substrate using dipping method.…”

“…Electro-plated polymernNi wires have been reported as a type of low-cost and industrial scalable electrode substrate for wireshaped solar cell [25]. As a typical type of low-cost and lightweight polymer substrate, insulated polybutylene terephthalate wire (0.2 mm) was selected and was chemically plated with a layer of Cu [25] to make the wire conductive before electro-plating.…”

“…As a typical type of low-cost and lightweight polymer substrate, insulated polybutylene terephthalate wire (0.2 mm) was selected and was chemically plated with a layer of Cu [25] to make the wire conductive before electro-plating. As is previously reported, the energy level and redox potential of Cu is not suitable for applications in DSSC [21,25]. Therefore, Ni was then electroplated on the polymernCu wire from an aqueous NiSO 4 solution (0.76 M) [25,26].…”

From wires to veins: wet-process fabrication of light-weight reticulation photoanodes for dye-sensitized solar cells

“…10,11 We previously assembled DSSC photoanodes on Ni/Cu wires via an electroplating method. 12 Through chemical-plating methods, Ni could be easily deposited on substrates of almost any shapes and any materials, including non-conductive polymers. Not only the weight and cost could be further reduced, but also the structure of the DSSC can be considerably extended.…”

“…Their performance was equivalent to that of a previously reported all-solid state ZnO-type wire-shaped DSSC. 12 Electrochemical impedance spectroscopy (EIS) analysis shows three frequency peaks in the Bode chart of Cu. The frequency peaks at 0 and 10 5.5 Hz correspond to the Cu/electrolyte interface and the Cu/CuI interface, respectively (Fig.…”