“…The etching targets are the surface electrode made of silver, the anti-reflection film (AR) including silicon nitride, the back electrode made of aluminum and the p-n junction part in the silicon wafer. In order to dissolve each target efficiently, various etching solutions were used sequentially as follows: HNO 3 -HCl-HF/ HNO 3 , 3) HCl-HF/HNO 3 , 3) NaOH-HF, 3) HF/HNO 3 /CH 3 -COOH, 8) HF/H 2 SO 4 /CH 3 COOH, 8) HF/HNO 3 -KOH, 9) H 3 PO 4 -HF/HNO 3 , 9) HF/HNO 3 /CH 3 COOH, 10,11) HF/ HNO 3 /Br 2 , 10,11) HF/HNO 3 /AgNO 3 , 12,13) NOHSO 4 /HF/ H 2 SO 4 12,13) and HF/HNO 3 /CH 3 COOH/Br. 14) However, there was little study on the etching rate of each component in the silicon solar cell when concentration of etching solution was varied widely.…”