2019
DOI: 10.1016/j.microrel.2019.113472
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Wear-out evolution analysis of multiple-bond-wires power modules based on thermo-electro-mechanical FEM simulation

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Cited by 5 publications
(5 citation statements)
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“…The wear-out predicted by this model is compared with the degradation reported by [15] to validate the mechanistic relationship of fig. 3.…”
Section: Model Predicted Wear-out Comparisonmentioning
confidence: 99%
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“…The wear-out predicted by this model is compared with the degradation reported by [15] to validate the mechanistic relationship of fig. 3.…”
Section: Model Predicted Wear-out Comparisonmentioning
confidence: 99%
“…4a and 4b shows that the model is able to predict the main degradation effects experienced by the device from [15]. As the Paris Law coefficients were not fitted to the degraded device from [15] the crack propagation rate should not be considered for the comparison instead the internal timing and behaviour should be. This example implementation was done in MATLAB.…”
Section: Model Predicted Wear-out Comparisonmentioning
confidence: 99%
“…In recent years, researchers have focused on developing models to improve the durability and reliability of electronic components used in various industrial applications. Thermal fatigue testing and physical modeling have been employed as means of generating precise models that describe the degradation of aluminum bonding wires caused by fatigue cracking [ 12 ]. The models developed by Musallam et al [ 13 ] have demonstrated that a mission profile-based approach can be used to estimate life consumption and assess reliability, reducing unscheduled maintenance, operating costs, and disruption of services.…”
Section: Introductionmentioning
confidence: 99%
“…The simulation procedure is one of the core steps of power module development. Generally, electrical, thermal, or mechanical simulations are conducted separately using specific software [9][10][11][12][13][14][15][16][17]. Electrical simulation software considers electrical properties, including parasitic inductance and resistance, current density, ohmic loss density, substrate voltage, and electric field in switching devices [9][10][11][12].…”
Section: Introductionmentioning
confidence: 99%
“…Thermal simulation software considers temperature distribution, maximum junction temperature, thermal resistance, and cooling performance [9,10,[13][14][15]. Mechanical simulation software considers von Mises stress, plastic strain, and deflection [13,[15][16][17]. In addition, new simulation tools with advanced models are actively being investigated for comprehensive and rapid power module simulations [18,19].…”
Section: Introductionmentioning
confidence: 99%