Water-Jet Cavitation Shock Bulging as Novel Microforming Technique

Abstract

With the continuous expansion of the application range of microelectromechanical systems, microdevice forming technology has achieved remarkable results. However, it is challenging to develop new microforming processes that are low cost, environmentally friendly, and highly flexible; the high-energy shock wave in a cavitation bubble’s collapse process is used as the loading force. Herein, a new process for the microbulging of the water-jet cavitation is proposed. A series of experiments involving the water-jet cavitation shock microbulging process for TA2 titanium foil is performed on an experimental system. The microforming feasibility of the water-jet cavitation is investigated by characterizing the shape of the formed part. Subsequently, the effects of the main parameters of the water-jet cavitation on the bulging profile, forming depth, surface roughness, and bulging thickness distribution of TA2 titanium foil are revealed. The results show that the plastic deformation increases nonlinearly with the incident pressure. When the incident pressure is 20 MPa, the maximum deformation exceeds 240 μm, and the thickness thinning ratio changes within 10%. The microbulging feasibility of water-jet cavitation is verified by this phenomenon.

Processing characteristics and loading principle on micro blanking of cavitation jet

“…From the simulation above, the cavitation cloud will collapse at a speci c distance and produce local high pressure. Based on the experiments performed by Li et al [25], when the incident pressure is 15 MPa and the nozzle aperture is 1.6mm, the cavitation jet machining effect is better at the target distance of 120mm. Cavitation jet micro blanking experiments were conducted on T2 copper foils with different thicknesses using circular, regular hexagonal, and regular quadrilateral Dies.…”

Multi-physical Modeling and Adjusting for Ultrasonic Assisted Soft Abrasive Flow Processing

“…There is no perfect solution to the simulation of ultrasonic cavitation in the turbulent flow field. In this paper, the turbulence parameters are modified based on the existing turbulence model for the cavitation effect caused by ultrasonic vibration to carry out more accurate simulation research [47,48]. The sound power of the sound field acts on the soft abrasive flow through sound pressure and its various effects.…”

Thermal Sintering Matchability between Low‐Temperature Cofired Ceramic Substrate and Silver Pastes and the Effect of CuO on Silver Diffusion Inhibition

“…Currently, LTCC technology is considered as one of the optimal methods to achieve multilayer ceramic packaging. [8] In the LTCC technology, the printing of electronic paste is very important for its electronic components, conductive circuits, and chip packaging technology. [9,10] With the development of miniaturization and integration of electronic components and thick film circuits, the distribution of circuits and components occupies less space.…”