2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2021
DOI: 10.1109/ectc32696.2021.00335
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Warpage of Compression Molded SiP Strips

Eric Ouyang
1
,
Yonghyuk Jeong
2
,
JaeMyong Kim
3
et al.
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Study on Package Warpage Based on Three-Dimensional Flow Simulation

Geng
1
,
Chen
2
,
Qin
3
et al. 2022
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Study on Package Warpage Based on Three-Dimensional Flow Simulation

Geng
1
,
Chen
2
,
Qin
3
et al. 2022
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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0
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Comparative Analysis of Flow Capability of Epoxy Molding Compound between Spiral Structure and Actual Mold by Mold Flow Simulation

Li
1
,
Zhong
2
,
Peng
3
et al. 2022
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Mold Flow Simulation Analysis of Molded Underfill in an Ultra-thin High-Density Package

Li
1
,
Zhong
2
,
Li
3
et al. 2022
2022 IEEE 5th International Conference on Electronics Technology (ICET)
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