Warpage and RDL Stress Analysis in Large Fan-Out Package with Multi-Chiplet Integration

Wong, Jen-Hsien; Wu, Nan-Yi; Lai, Wei‐Hong; Chen, Dao-Long; Chen, Tang-Yuan; Chen, Chung-Hao; Wu, Yi-Hsien; Chang, Yung-Shun; Kao, C. R.; Tarng, David; Lee, Teck Chong; Hung, Chih-Pin

doi:10.1109/ectc51906.2022.00173

Cited by 6 publications

(2 citation statements)

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“…Moreover, the spacing between chiplets is filled by EMC, and the overall deformation of electronic packaging vehicles is aggravated due to CTE mismatch and EMC chemical shrinkage. Chip-last, process-based FO multi-chiplet integration design was developed, and its process-induced warpage and RDL stress issues were analyzed [ 37 ]. The ring- and cavity-type heat spreaders are designed to improve the warpage behavior of the concerned vehicle by the high stiffness of the heat spreader.…”

Section: Introductionmentioning

confidence: 99%

“…The stress-induced failure in chiplet applications is costly and unbearable because the failure of a single die would cause failure of the monolithic chip [ 30 ], but current studies are focused on the warpage behavior investigation of multi-chiplet systems [ 32 , 37 ]. Accordingly, the stress generation mechanism during fabrication of chiplet integration vehicles needs to be explored, and the induced stress needs to be managed to improve long-term reliability.…”

Section: Introductionmentioning

confidence: 99%

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Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach

et al. 2023

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The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

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Section: Introductionmentioning

confidence: 99%