Warpage analysis and improvement for a power module

Liu, Yong; Liu, Yumin; Yuan, Zhongfa; Chen, Tyler; Lee, Keunhyuk; Belani, Suresh

doi:10.1109/ectc.2013.6575614

Cited by 5 publications

(3 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Typically, the curvature of the entire surfaces are scanned using methods such as photo processing of surfaces illuminated by Moire patterns [22], [23], gate timing of scanning acoustic microscopes [24] or using a laser deflection sensor to scan parallel lines along the object [25], [26]. These methods are usually used to measure the warpage caused by: large temperature swings during soldering [25], temperature cycling for wear out testing [27] or mechanical assemblies such as molding [28]. The benefit of these methods is that they map the curvature of the entire surface, and thus provide a detailed mapping of the deflection at several points of the investigated surface.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors

Jørgensen

Munk‐Nielsen

Uhrenfeldt

2021

IEEE Trans. Power Electron.

View full text Add to dashboard Cite

Digital design has been successfully employed in development of new compact wide bandgap power modules, achieving unprecedented switching speeds while maintaining low thermal resistance. Owing to the achieved performance, the next step in the field is ensuring that proposed designs are mechanically robust and reliable. The new power module structures lack the long history of experimental experience as is the case with conventional silicon power modules. To limit the number of physical prototypes that needs to be built and to speed up development time, having a verified simulation model of the thermomechanical behavior is of great value to designers. In this paper a finite element simulation of the thermomechanical induced stress and strain is presented of an integrated GaN fullbridge switching cell. The simulated strain of the power module is verified by an experimental test. During the test, one of the semiconductor devices of the module is subjected to a power loss. A laser displacement sensor is used to measure the in-situ deflection of the ceramic substrate caused by the temperature increase. The experimental results confirm the ability of the simulation model to accurately predict the deflection within an error of only 7.3 %.

show abstract

Section: Introductionmentioning

confidence: 99%

Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors

Jørgensen

Munk‐Nielsen

Uhrenfeldt

2021

IEEE Trans. Power Electron.

View full text Add to dashboard Cite

show abstract

“…The requirement for highly integrated electronic devices prompts the packaging industry to find out the new packaging solutions. In order to realize the power module packaging, ceramic and organic polymer substrates has been used to integrate semiconductor chips [1] .…”

Section: Introductionmentioning

confidence: 99%

Warpage analysis of DBC substrate based on non-contact shadow moiré technology

Duan

Zhu

Chen

et al. 2014

2014 15th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were cut was selected as the measure object. A measurement system based on non-contact shadow moiré technology is applied to obtain the three dimensional profile of this array of DBC substrate. The warpage of the whole field of array of DBC substrate and the height of single substrate obtained.

show abstract

“…The structure of the power modules usually contains the IGBTs/Mosfets, IC dice, and passive components [1], [2]. For such system in package, generally more than 20 I/O pins are required, with pins for power I/Os at one side, and pins for IC I/Os at the other side [3], [4], [5]. The assembly manufacture processes become more challenging in order to manufacture robust products and achieve high yields [6].…”

Section: Introductionmentioning

confidence: 99%

Parameter optimization in assembly manufacturing process for a power module

Liu

2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

Self Cite

View full text Add to dashboard Cite

In this paper, the trimming process in manufacture of a power module is investigated by using the commercial FE code Ansys/LSdyna®. The setup of the trimming process consists of an automated system of cutting die, stripper, punch, and etc. The design and interworking of these tools are quite critical. On one hand, when the gap between the punch and stripper/cutting die is too big, the dambar may not be fully cut as expected. On the other hand, when the gap is too small, the punch might be broken after some cycles due to flash contamination on the tools. If the stripper clamp is too close to the package body, high stress might be generated in the package edge or even in the silicon chips to induce package crack or die crack. The DoE legs with regard to the gap between the punch & stripper and the distance between the stripper clamp & the package body are conducted by the FE dynamic simulations. The simulation results provide good guidance for the assembly process parameter setting. .

show abstract

Warpage analysis and improvement for a power module

Cited by 5 publications

References 6 publications

Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors

Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors

Warpage analysis of DBC substrate based on non-contact shadow moiré technology

Parameter optimization in assembly manufacturing process for a power module

Contact Info

Product

Resources

About

Warpage analysis and improvement for a power module

Cited by 5 publications

References 6 publications

Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors

Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors

Warpage analysis of DBC substrate based on non-contact shadow moir&#x00E9; technology

Parameter optimization in assembly manufacturing process for a power module

Contact Info

Product

Resources

About

Warpage analysis of DBC substrate based on non-contact shadow moiré technology