Waferbond technologies and quality assessment

Wiemer, M.; Frömel, Jörg; Jia, Chuan-Lei; Haubold, Marco; Geßner, Thomas

doi:10.1109/ectc.2008.4549989

Cited by 1 publication

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The available bonding techniques used for industrial or research applications can be classified as: silicon fusion bonding [1], low temperature direct bonding [2], anodic bonding [3], eutectic bonding [4], glass-frit bonding [5] and adhesive bonding [6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

SU8 Adhesive Bonding using Contact Imprinting

Iliescu

Tay

et al. 2006

2006 International Semiconductor Conference

View full text Add to dashboard Cite

The present work proposes an adhesive bonding technique, at wafer level, using negative photoresist as intermediate layer. The adhesive was selective imprint on one of the bonding surface. The main applications are in microfluidic area where a low temperature bonding is required. The method consists of three major steps. First the adhesive layer is deposited on one of the bonding surface by contact imprinting from a dummy wafer where the SU-8 photoresist was initially spun, orfrom a Teflon cylinder. Second, the wafers to be bonded are placed in contact and aligned. In the last step, the bonding process is performed at temperatures between 1000C and 2000C, a pressure of 1000 N in vacuum on a classical wafer bonding system. The results indicate a low stress value induced by the bonding technique. In the same time the process presents a high yield. 95-100%. The technique was successfully tested in the fabrication process of a dielectrophoretic device.

show abstract