2021
DOI: 10.48550/arxiv.2111.00576
|View full text |Cite
Preprint
|
Sign up to set email alerts
|

Wafer-scale, full-coverage, acoustic self-limiting assembly of particles on flexible substrates

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2023
2023
2023
2023

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(1 citation statement)
references
References 34 publications
0
1
0
Order By: Relevance
“…Particles involved graphene, carbon nanotube, carbon black, and so on. 32,33 Thus, ultrasonic-assisted methods may also have a good application prospect in the preparation of hydrogen barrier membranes involving the LBL assembly of two-dimensional materials. On this basis, the present study prepared GO/PEI films under ultrasonic conditions.…”
Section: Introductionmentioning
confidence: 99%
“…Particles involved graphene, carbon nanotube, carbon black, and so on. 32,33 Thus, ultrasonic-assisted methods may also have a good application prospect in the preparation of hydrogen barrier membranes involving the LBL assembly of two-dimensional materials. On this basis, the present study prepared GO/PEI films under ultrasonic conditions.…”
Section: Introductionmentioning
confidence: 99%