Wafer‐Scale Fabrication of 2D Nanostructures via Thermomechanical Nanomolding

Abstract

With shrinking dimensions in integrated circuits, sensors, and functional devices, there is a pressing need to develop nanofabrication techniques with simultaneous control of morphology, microstructure, and material composition over wafer length scales. Current techniques are largely unable to meet all these conditions, suffering from poor control of morphology and defect structure or requiring extensive optimization or post‐processing to achieve desired nanostructures. Recently, thermomechanical nanomolding (TMNM) has been shown to yield single‐crystalline, high aspect ratio nanowires of metals, alloys, and intermetallics over wafer‐scale distances. Here, TMNM is extended for wafer‐scale fabrication of 2D nanostructures. Using In, Al, and Cu, nanomold nanoribbons with widths < 50 nm, depths ≈0.5–1 µm and lengths ≈7 mm into Si trenches at conditions compatible is successfully with back end of line processing . Through SEM cross‐section imaging and 4D‐STEM grain orientation maps, it is shown that the grain size of the bulk feedstock is transferred to the nanomolded structures up to and including single crystal Cu. Based on the retained microstructures of molded 2D Cu, the deformation mechanism during molding for 2D TMNM is discussed.