Wafer-Level Packaging Technology for High-<tex>$Q$</tex>On-Chip Inductors and Transmission Lines

High quality factor copper inductors integrated in deep dry-etched quartz substrates

“…The achieved performances in terms of Q PEAK and SRF are in the current state-of-the-art for integrated inductors [5,11].…”

High-Performance Compact 3-D Solenoids for RF Applications

“…5(c)). Then, characteristics of some high-Q above-IC planar inductors [13] are reported in Fig. 5, as well.…”

“…5, as well. The process, as described in [13], is very close to best available IPD technologies: the inductor spiral is a 10 µm thick copper strip integrated on a 28 µm low r thick insulating layer of benzocyclobutene (BCB), with a 10 µm thick copper underpass implemented 12 µm underneath. This time, it can be observed that the area of these inductors is about twice the area of 3-D solenoids ( Fig.…”

Advanced Microwave Circuits and Systems

“…BCB has good dielectric properties and mechanical chericteristics and verified realiability, and so it has been the most widely used insulation material for IPD or other passivation applications (Tilmans H. A C et al, 2003;Carchon G. J. et al, 2005). Based on the above-stated device achitecture, materials and fabrication technologies, many IPD devices have been developed and practically used due to their good RF performances, compact size and high manufacture tolerance at serval companies like IMEC (Carchon G. J. et al, 2005;Tilmans H. A C et al, 2003), Sychip (Davis P. et al, 1998), Telephus (Jeong I-H. et al, 2002;Kim D. et al, 2003), Philips (Graauw A. et al, 2000;Pulsford N., 2002), TDK (CHEN R. et al, 2005), Fujitsu (Mi X. et al, 2007;Mi X. et al, 2008). IMEC IPD used borosilicate glass, TaN resistors, Ta2O5 capacitors and electropalated Cu for coils and interconnects.…”