Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab

Tilmans, H.A.C.; Ziad, H.; Jansen, Henricus V.; Monaco, O. Di; Jourdain, Anne; Raedt, W. De; Rottenberg, Xavier; Backer, E. De; Decaussernaeker, A.; Baert, Kris

doi:10.1109/iedm.2001.979663

Cited by 67 publications

(40 citation statements)

References 4 publications

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“…The interface layer is in the order of microns in-between the wafers, and is usually electrically and thermally insulating. In multichip module packaging and recently wafer bonding the use of the benzocyclobutene (BCB)-based negative resist family Cyclotenet of Dow Chemical Company has been used with good results [41][42][43].…”

Section: Adhesive Bondingmentioning

confidence: 99%

Transfer of InP epilayers by wafer bonding

Hjort

2004

Journal of Crystal Growth

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Section: Adhesive Bondingmentioning

confidence: 99%

Transfer of InP epilayers by wafer bonding

Hjort

2004

Journal of Crystal Growth

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“…In wafer-level packaging technologies the MEMS structure is encapsulated in a sealed cavity realizing a first protective interface for the mechanical components already during the wafer processing (Gooch et al 1999). Commonly proposed approaches for wafer-level MEMS packages use either chip-capping (Tilmans et al 2001) or thin film capping (Leedy et al 2007) technologies. In either case, these packaging solutions should protect the MEMS components with a sufficiently strong encapsulation during both fabrication and operation, by keeping stable gas and pressure conditions without affecting the performance of the devices with induced deformations.…”

Section: Introductionmentioning

confidence: 99%

Modeling of gold microbeams as strain and pressure sensors for characterizing MEMS packages

et al. 2012

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This work presents the modeling of gold microbeams for characterizing Micro-electro-mechanical systems (MEMS) packages in terms of both strains induced to the MEMS devices and hermetic sealing capability. The proposed test structures are based on arrays of rectangularshaped clamped-free and clamped-clamped beams, to be realized with a film of electroplated gold by surface micromachining technology. The resonant frequency of the microbeams is modeled by FEM simulations as a function of substrate deformations, which could be induced by the package. Clamped-clamped bridges show a linear change of the square of the resonant frequency in case of in-plane deformations, in fairly good agreement with an approximate analytical model. Cantilever beams are modeled as variable capacitors to detect out-of-plane deformations. Finally, an analytical model to study cantilever beams as resonators for detecting pressure changes is discussed and compared with preliminary experimental results, showing an impact on the quality factor in a range from 10 -2 mbar to 1 bar.

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“…It was reported that Pyrex glass is suitable for low cost wet-etching technology and that it is compatible with RF applications [5]. One strong adhesive-bonding candidate is a photo-patternable polymer benzocyclobutene (BCB) chosen for its minimal outgassing, low moisture uptake and excellent electrical properties [6,7], and its flow characteristics during the bonding process provide good sealing for signal feed-throughs [3,10]. In the conventional approach, BCB sealing rings are patterned after the formation of the housing cavity; the large areas between housing cavities are needed to coat the polymer and to make sealing rings large enough to realize uniform BCB bonding rings.…”

Section: Introductionmentioning

confidence: 99%