Abstract:Wafer-level processed and wafer-level packaged low-cost microelectromechanical system (MEMS) thermal sensors are required for a wide range of Internet of Things (IoT) and wearables applications. Recently, a new generation of uncooled thermal sensors based on CMOS-SOI-MEMS technology has emerged, with higher performance compared to commercial thermal sensors (bolometers, thermopiles, and pyroelectric sensors). The technology is implemented in commercial CMOS FABs and is, therefore, based on mature technology an… Show more
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