Wafer level interconnects for 3D packaging

Banerjee, Srutarshi; Drayton, R.F.

doi:10.1109/ectc.2004.1320315

Cited by 2 publications

(1 citation statement)

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“…Above 30 GHz, the insertion loss was predominated by the onset of a structural resonance. Banerjee and Drayton [21] designed and measured both monolithic (on the same substrate) and hybrid (on different substrates, similar to QP) packages built on high-resistivity silicon substrates (> 2000 Ω • cm) using double aluminum wirebonds. The insertion loss due to the wirebonds was 0.15 dB for the monolithic package at 50 GHz and 0.5 dB for the hybrid package at 40 GHz, respectively.…”

Section: Table I Dimensions Of the 100 µM Qp Interconnects (Unit: µM)mentioning

confidence: 99%

A Novel Scheme for Wide Bandwidth Chip-to-Chip Communications

Liu

Fay

Bernstein

2007

Journal of Microelectronics and Electronic Packaging

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Quilt Packaging (QP), a novel chip-to-chip communication paradigm for system-in-package integration, is presented. By forming protruding metal nodules along the edges of the chips and interconnecting integrated circuits (ICs) through them, QP offers an approach to ameliorate the I/O speed bottleneck. A fabrication process that includes deep reactive ion etching, electroplating, and chemical-mechanical polishing is demonstrated. As a low-temperature process, it can be easily integrated into a standard IC fabrication process. Three-dimensional electromagnetic simulations of coplanar waveguide QP structures have been performed, and geometries intended to improve impedance matching at the interface between the on-chip interconnects and the chip-to-chip nodule structures were evaluated. Test chips with 100 μm wide nodules were fabricated on silicon substrates, and s-parameters of chip-to-chip interconnects were measured. The insertion loss of the chip-to-chip interconnects was as low as 0.2 dB at 40 GHz. Simulations of 20 μm wide QP structures suggest that the bandwidth of the inter-chip nodules is expected to be above 200 GHz.

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Section: Table I Dimensions Of the 100 µM Qp Interconnects (Unit: µM)mentioning

confidence: 99%