Wafer level embedded System in Package (WL-eSiP) for mobile applications

Kang, Insoo; Jung, Gi-Jo; Jeon, Byoung-Yool; Yoo, Jae-Hyouk; Jeong, Seonghun

doi:10.1109/ectc.2010.5490956

Cited by 7 publications

(2 citation statements)

References 7 publications

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“…As for packaging technology, miniaturization of chips and packages, high density of I/O, and Fan-out PKG process applicability have been increasing. [1][2][3][4][5] To achieve these requirements, typical properties required for wafer coating materials include a higher resolution for higher electrode density and low temperature curable at the heat temperature of the substrate material of the Fan-out package. And other properties such as high insulation and heat resistance are required to package power semiconductors.…”

Section: Introductionmentioning

confidence: 99%

Reliability Study for Photosensitive RDL Material

Shiraishi,

Takahashi,

Kawasaki

2023

J. Photopol. Sci. Technol.

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In recent years, as electronic devices such as smartphones become more functional, more compact, and lower cost, many semiconductor makers are studying the packages such as WLP (Wafer Level Package) having re-distribution layer (RDL). With the miniaturization and the increase in the number of pins of a semiconductor package, the method of conduction between a semiconductor chip and an external electrode has been changed from wire connection to bump connection and RDL. And the application of a wafer coating material is also required to have higher functions from a buffer coat film to bump protection and an interlayer insulating film for RDL. Further, in recent years, in addition to the purpose of avoiding the performance deterioration of the semiconductor device due to the hightemperature treatment, a packaging material having low heat resistance is sometimes used in the FOWLP, and therefore, the wafer coating material is required to lower temperature curable. We have studied the reliability of the RDL package with various RDL photosensitive materials.

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Section: Introductionmentioning

confidence: 99%

Reliability Study for Photosensitive RDL Material

Shiraishi,

Takahashi,

Kawasaki

2023

J. Photopol. Sci. Technol.

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“…E MBEDDED wafer-level packaging (eWLP) draws more and more attraction due to its inherent advantages, i.e., high density, low cost, and high yields [1]. Many researchers are dedicated to wafer-level molding process, based on single chip [2], [3] as well as multiple-chip package [4]- [6].…”

Section: Introductionmentioning

confidence: 99%

Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps

Velez

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

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Decaps are the panacea for the noise-related issues. Due to the short distance advantage, decaps are embedded in the fan-out wafer-level package instead of the printed circuit board. These decaps, generally thicker than chips, will have a crucial influence on the molding process as well. A lot of issues are encountered in the molding process, especially with lots of decaps, i.e., voids issues, incomplete filling issues, and die shift issues. In an optimized design, all these issues should be prevented or reduced as much as possible. In this paper, design flow for the wafer-level molding process is demonstrated and design guidelines are provided. Three important evaluation standards are used to evaluate the design, i.e., incomplete filling, drag force, and voids. Two kinds of design parameters, structure parameters (i.e., die placement, die size and thickness, and so on) and process parameters (i.e., vacuum pressure, filling speed, and so on), are optimized in the whole study. Optimization of these parameters helps the real wafer-level molding process to be conducted smoothly.

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Investigation on decap shift and incomplete fill issues in the wafer level compression molding process

Velez

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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Wafer level embedded System in Package (WL-eSiP) for mobile applications

Cited by 7 publications

References 7 publications

Reliability Study for Photosensitive RDL Material

Reliability Study for Photosensitive RDL Material

Design and Optimization of Wafer-Level Compression Molding Process for One Chip Plus Multiple Decaps

Investigation on decap shift and incomplete fill issues in the wafer level compression molding process

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