Wafer-Level Contactless Testing Based on UHF RFID Tags With Post-Process On-Chip Antennas

Finocchiaro, Alessandro; Girlando, G.; Motta, A.; Pagani, Alberto; Ragonese, Egidio; Palmisano, G.

doi:10.1109/tcsii.2018.2852949

Cited by 5 publications

(4 citation statements)

References 9 publications

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“…The biomedical related WPTs [13][14][15][16][17] could transfer the power through a greater distance with a very large TX chip size. The wafer-level testing related WPTs [2,18,19] performs the power delivery in a much shorter distance, but the TX chip area is much smaller. When the trade-off between the TX chip size and the delivered distance is eliminated, small RX chip size and maximum power delivery are the most critical factors required for both biomedical WPTs and wafer-level testing WPTs.…”

Section: Simulation Results Of a Multi-channel Sub-thz Wpt Interfacementioning

confidence: 99%

“…When the trade-off between the TX chip size and the delivered distance is eliminated, small RX chip size and maximum power delivery are the most critical factors required for both biomedical WPTs and wafer-level testing WPTs. The proposed WPT RX chip occupies only 0.098 mm 2 area (5 times smaller than the smallest one [19]). The maximum power delivery of the proposed WPT is 20 mW (only [16] could provide 4 times more power, but the RX chip size is 367 times larger).…”

Section: Simulation Results Of a Multi-channel Sub-thz Wpt Interfacementioning

confidence: 99%

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A Sub-THz Wireless Power Transfer for Non-Contact Wafer-Level Testing

Dang-ba

Byun

2020

Electronics

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In this paper, a sub-THz wireless power transfer (WPT) interface for non-contact wafer-level testing is proposed. The on-chip sub-THz couplers, which have been designed and analyzed with 3-D EM simulations, could be integrated into the WPT to transfer power through an air media. By using the sub-THz coils, the WPT occupies an extremely small chip size, which is suitable for future wafer-testing applications. In the best power transfer efficiency (PTE) condition of the WPT, the maximum power delivery is limited to 2.5 mW per channel. However, multi-channel sub-THz WPT could be a good solution to provide enough power for testing purposes while remaining high PTE. Simulated on a standard 28-nm CMOS technology, the proposed eight-channel WPT could provide 20 mW power with the PTE of 16%. The layouts of the eight-channel WPT transmitter and receiver occupy only 0.12 mm2, 0.098 mm2, respectively.

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Section: Simulation Results Of a Multi-channel Sub-thz Wpt Interfacementioning

confidence: 99%

Section: Simulation Results Of a Multi-channel Sub-thz Wpt Interfacementioning

confidence: 99%

A Sub-THz Wireless Power Transfer for Non-Contact Wafer-Level Testing

Dang-ba

Byun

2020

Electronics

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“…One AoC for the wearable applications has also been presented [126]. Likewise, one AoC for the contactless testing of the ICs in the fabrication phase has also been proposed [127].…”

Section: Application In Low-frequency Bandsmentioning

confidence: 99%

“…• RFID and AoCs based ICs measurement setup: In [127], a novel method has been proposed at 965 MHz with the help of RFID and an array of post-processed coil AoCs, which empowers a contact-less measurement of the ICs at the wafer level. The method is more economical than the conventional I/O pads based testing of the large ICs because of its small chip-area consumption and low-cost post-processing of the AoCs.…”

Section: ) Novel Measurement Setups For Ics Using Aocs For the Mitigation Of Constraints Posed By The Conventional Setups: Potentials Chamentioning

confidence: 99%

The Potentials, Challenges, and Future Directions of On-Chip-Antennas for Emerging Wireless Applications—A Comprehensive Survey

et al. 2019

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The ever-growing demand for low power, high performance, cost-effective, low-profile, and highly integrated wireless systems for emerging applications has triggered the need for the enormous innovations in wireless transceiver systems, components, architectures and technologies. This is especially valid for the antenna which is an integral component of the wireless transceiver systems and contributes significantly in determining their overall performance. Antenna-on-Chip (AoC) is an alternative antenna technology, which has drawn a substantial attention in recent days because of its various benefits over off-chip antenna technology. A few of these benefits include miniaturization, low power, low cost, and high integration of the wireless modules. Motivated by these valuable advantages and to unveil the true potential of the AoCs, this article presents, for the first time, a comprehensive survey of the suitability, advantages, and challenges of the AoCs for the emerging wireless applications such as 5th generation (5G) Wireless Systems, Internet-of-Things (IoT) Wireless Devices and Systems, Wireless Sensor Networks (WSNs), Wireless Interconnects, Wireless Energy Transfer, Radio Frequency (RF) Energy Harvesting, Biomedical Implants, Unmanned Aerial Vehicles (UAVs), Autonomous vehicles, Innovative characterization methods for Integrated Circuits (ICs) and Antennas, and Smart City. In addition, this article presents the current stateof-the-art of the AoC's applications by classifying their applications in Millimeter-Wave (MM-Wave) band, Terahertz (THz) band, and low-frequency bands. The article also investigates and describes some useful methods for the mitigation of the challenges and issues posed by the emerging applications for the realization of the AoCs in a systematic manner. A concise description of the future directions of the AoCs with respect to each emerging application is also a part of this article. It is expected that this well-structured and organized survey will not only act as an excellent source of scholarship for the relevant research community, but also open up a world of novel research opportunities.

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A Fully Integrated Low-Cost HF Multistandard RFID Reader SoC and Module for IoT Applications

Wang

Wu³

2022

IEEE Internet Things J.

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Wafer-Level Contactless Testing Based on UHF RFID Tags With Post-Process On-Chip Antennas

Cited by 5 publications

References 9 publications

A Sub-THz Wireless Power Transfer for Non-Contact Wafer-Level Testing

A Sub-THz Wireless Power Transfer for Non-Contact Wafer-Level Testing

The Potentials, Challenges, and Future Directions of On-Chip-Antennas for Emerging Wireless Applications—A Comprehensive Survey

A Fully Integrated Low-Cost HF Multistandard RFID Reader SoC and Module for IoT Applications

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