Wafer-level capping and sealing of heat sensitive substances and liquids with gold gaskets

Vacuum packaging and semipassive chips for wireless temperature monitoring in industrial applications

“…The jar contains a double chamber, where the electronics are placed in the inner volume, and the intermediate volume is filled by vacuum or air (Figure 1A). A ceramic disk (1) is placed in between the jar (2) and the cover (3), with the purpose of reducing the thermal conduction between the thick metallic cover and the thin jar wall. The jar fits tightly in the cover.…”

“…They are usually fragile sensors like accelerometers, gyroscopes, and also resonant MEMS, where the objective is to minimize energy loss and improve their signal-to-noise ratio. However, most of the research on vacuum packaging [1][2][3] relies on the hermetic encapsulation of the mechanical sensor at chip or wafer level, but not at "smart system level".…”

Narrow footprint copper sealing rings for low-temperature hermetic wafer-level packaging

“…Much effort has been devoted to minimize the metal sealing structure footprint for reducing die-size and process cost. Wafer-level encapsulation is reported to be achieved with 1.5 -7 μm-wide sealing rings of Au, but the mechanical support needs to be enhanced by additional solder pads featuring dimensions of over 100 μm [6] or by polymer underfill [7,8]. 3 μm-wide Al sealing rings have been reported for wafer-level hermetic packaging at a high temperature of 450 °C [9].…”

Dye-based photonic sensing systems

“…This problem can be overcome by exclusively using non-reactive materials, such as metals, inside the sensor cavities [11][12][13][14]. For the photonic sensors realized here, a roomtemperature wafer-scale packaging approach is utilized [15]. The sensor cavity is sealed by a plastically deformable metal gasket in combination with a room-temperature curable epoxy outside the sensor cavity to provide the permanent bond between the parts of the package.…”