Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond

Lin, Yu Min; Hsu, Steven; Hsu, L. C.; Hsu, Cheng Hsiung; Wu, C. L.; Lee, W. K.; Lin, Wen-Chin; Sie, W. S.; Liu, Y. L.; Lee, Y. T.; Wang, Oliver; Huang, Chien Chung; Lin, Jian-Yang; Wu, J. Y.

doi:10.1109/icpt.2014.7017284

Proceedings of International Conference on Planarization/CMP Technology 2014 2014

DOI: 10.1109/icpt.2014.7017284

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Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond

Yu Min Lin

Steven Hsu

L. C. Hsu

et al.

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Wafer extreme-far edge related study in BEOL (Back-End-of-Line) including BEOL chemical mechanical polishing at 28nm technology node and beyond

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