Wafer Bonding with BCB and SU-8 for MEMS Packaging

Wiemer, M.; Jia, Chuan-Lei; Toepper, Michael; Hauck, Karin

doi:10.1109/estc.2006.280194

Cited by 18 publications

(8 citation statements)

References 5 publications

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“…Various kinds of materials have been used as the adhesive layers, most are also patternable, for example, photoresist (SU-8 [11] , AZ4260 [12] ), Benzocyclobuten (BCB) [13] and parylene [14] . However, the intermediate layer, parylene and patterned SU-8 are difficult for bonding and AZ4620 bonding has poor bonding strength.…”

Section: Figure2 Schematic Of a Chip-scale Atomic Clock Physics Packmentioning

confidence: 99%

Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC)

Zhang

Zhu

et al. 2015

10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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This paper demonstrates a five layers wafer level packaging. This technology has been specially developed for chip scale atomic clock system package. It includes a sealed vapor cell and two supports for vertical-cavity surface-emitting lasers and photodetector. The sealed cavity is achieved by Glass-Silicon-Glass (G-S-G) anodic bonding with high hermeticity, high reliability and low bonding temperature (400º C). The triple structure is supported by two silicon wafers. It is realized by photosensitive BCB adhesive bonding with good uniformity, relatively high mechanical strength (8Mpa) and low bonding temperature (250ºC ). The results show that over 60% of wafer is bonded with no void on the joint area and well aligned. At last, the stacked wafer is diced into individual chips.

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Section: Figure2 Schematic Of a Chip-scale Atomic Clock Physics Packmentioning

confidence: 99%

Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC)

Zhang

Zhu

et al. 2015

10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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“…The use of a glass channel on a SAW substrate requires bonding of two stiff materials, with high and different temperature coefficients. Here the cavity sealing was performed by a thin adhesive layer of SU8 as employed in MEMS-packaging [61] but not generally employed in microfluidics. The adhesive bonding method was selected since it is not sensitive to the surface roughness expected for a wet etched borosilicate glass and does not require precise matching of the thermal expansion coefficients of the two layers.…”

Section: Device Fabricationmentioning

confidence: 99%

Surface acoustic wave-induced precise particle manipulation in a trapezoidal glass microfluidic channel

Johansson

Enlund

Johansson

et al. 2012

J. Micromech. Microeng.

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Surface acoustic wave (SAW) excitation of an acoustic field in a trapezoidal glass microfluidic channel for particle manipulation in continuous flow has been demonstrated. A unidirectional interdigital transducer (IDT) on a Y-cut Z-propagation lithium niobate (LiNbO 3) substrate was used to excite a surface acoustic wave at approximately 35 MHz. An SU8 layer was used for adhesive bonding of the superstrate glass layer and the substrate piezoelectric layer. This work extends the use of SAWs for acoustic manipulation to also include glass channels in addition to prior work with mainly poly-di-methyl-siloxane channels. Efficient alignment of 1.9 μm polystyrene particles to narrow nodal regions was successfully demonstrated. In addition, particle alignment with only one IDT active was realized. A finite element method simulation was used to visualize the acoustic field generated in the channel and the possibility of 2D alignment into small nodal regions was demonstrated.

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“…In contrast, adhesive bonding with polymers can be used for all types of material since it is a low-temperature technique [8][9][10][11][12][13][14][15]. This is not without its own problems.…”

Section: Introductionmentioning

confidence: 99%

Wafer level hermetic bonding and packaging using recrystallized parylene

Maharshi¹,

Ahmad²,

Agarwal³

et al. 2022

J. Micromech. Microeng.

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This work reports a wafer-level vacuum packaging technique for MEMS using recrystallized parylene material as a bonding layer. The effect of thermal annealing on the crystallinity of the parylene surface was demonstrated. The low-temperature, stable, homogeneous, and defect-free recrystallized parylene is found as an excellent bonding material for hermetic packages, suitable for the packaging of MEMS sensors. The material's recrystallization improves its capabilities as a moisture and air barrier. The mechanical stability of the bond interface was also investigated by measuring the package's tensile and shear strength. In the absence of a vacuum bonding tool, a Ti getter was integrated into the cavity of the glass capping wafer to create the vacuum and test the hermeticity. The MEMS silicon Pirani gauge was used to monitor the pressure changes inside the sealed cavity. After the getter activation, it was observed that there was a decrease in the pressure from atmospheric pressure to 0.2 mbar for the first few days; after that, no noticeable change was observed. The hermeticity of the packaged device was examined, and the vacuum level inside the package remained the same for the last 70 days. The recrystallized parylene bonded micro package shows better hermeticity than the non-recrystallized parylene micro package.

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Wafer Bonding with BCB and SU-8 for MEMS Packaging

Cited by 18 publications

References 5 publications

Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC)

Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC)

Surface acoustic wave-induced precise particle manipulation in a trapezoidal glass microfluidic channel

Wafer level hermetic bonding and packaging using recrystallized parylene

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