Voltammetric comparison between platinum with preferred orientation and platinum single crystal electrodes

Cerviño, R. M.; Triaca, Walter Enrique; Arvía, Alejandro Jorge

doi:10.1016/0013-4686(85)85009-x

Cited by 22 publications

(15 citation statements)

References 21 publications

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“…Likewise, we see no indication of surface faceting, as has previously been observed during gas phase treatment in H 2 + O 2 mixtures [12]. From previous studies [21] it is known that these structures consist of polycrystalline material (average grain size 4 nm), and it will be interesting to see in future studies whether the electrochemical treatment leads to changes in the crystallinity of the nanoparticles, as was observed, e.g., during electrochemical annealing of polycrystalline Pt [22] or during H 2 + O 2 gas phase treatment [12].…”

Section: Catalyst Morphology and Surface Compositionsupporting

confidence: 70%

“…It should be noted that the positive potential limit is important since too high potentials may result in changes of the morphology of the Pt nanoparticles due to repetitive oxidation and reduction of the Pt surface (Ôelectrochemical annealingÕ [22]). The present limit of 1.16 V is a compromise between maximizing the electrooxidation of contaminants and minimizing changes in the morphology of the nanoparticles as well as oxidation of the support.…”

Section: Electrochemical Characterizationmentioning

confidence: 99%

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Nanostructured platinum-on-carbon model electrocatalysts prepared by colloidal lithography

Gustavsson

Fredriksson

Kasemo

et al. 2004

Journal of Electroanalytical Chemistry

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Section: Catalyst Morphology and Surface Compositionsupporting

confidence: 70%

Section: Electrochemical Characterizationmentioning

confidence: 99%

Nanostructured platinum-on-carbon model electrocatalysts prepared by colloidal lithography

Gustavsson

Fredriksson

Kasemo

et al. 2004

Journal of Electroanalytical Chemistry

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“…In electrochemistry similar effects are reported recently, too (see e.g. [25,26]). It is noteworthy that the time evolution of the state of a copper surface in alkaline solutions is faster in the presence of sulfate (0.15 ml/l) than in the presence of fluoride (0.1 rnol/l), EDTA, which at pH 11.8 exists in its tetra deprotonated form EDTA 4 -, is not specifically adsorbed on copper electrodes in the potential range < -0.6 V (see Sec.…”

Section: Discussionsupporting

confidence: 87%

Impedance Studies of Copper in Alkaline Solutions, Especially During Electroless Plating

Wanner

Wiese

Weil

1988

Ber Bunsenges Phys Chem

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An impedance study of the electrochemical double layer of copper in an electro less copper plating bath was performed. Of the bath components (formaldehyde, ethylenediamine-tetraacetic acid (EDTA), CuEDTA 2 -, NaOH, Na ZS04, and NaHCOO) only the influence of hydroxide on the double layer is visible from capacitance data. The estimated surface coverage of hydroxide at the mixed potential of the electroless plating process is about 10%. On copper single crystal surfaces the OH --adsorption shows specific characteristics. Due to a surface reconstruction these characteristics, however, disappear with time after the immersion of the electrode. During the deposition process high electrode capacitances are measured (200-500 J-lF/cm 2 ). They are mainly caused by a surface roughness on the microscopic scale. When the deposition process is terminated, the surface relaxes within about 10 minutes. The addition of cyanide or Gafac (a mixture of organic esters of phosphoric acid) to the electroless plating bath markedly influences the capacitance data. However, always a correlation between the deposition rate and the electrode capacitance is observed. If, on the other hand, at potentiostatic cupric ion reduction formaldehyde in the plating bath is substituted by ethylenediamine, which also catalyzes the CuEDTA2--reduction, the capacitance values decrease with increasing deposition current. Presumably, in the first case the nucleation rate dominates the deposit growth, while in the second case the opposite is true. is of electrochemical nature [3 -5]. A mixed potential is established during the chemical deposition process. Electroless copper plating consists of the electrochemical reactions:[CuEDTA]2-+2H 2CO+40H-------+

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“…In addition, one should consider that, from procedures I and II, some electrochemical faceting of noble metals (platinum, palladium, ruthenium) by applying triangular periodic potential routines in aqueous acids also occurs [55][56][57][58][59][60].…”

Section: Discussionmentioning

confidence: 99%

Sequential and simultaneous electrodeposition of Pt–Ru electrocatalysts on a HOPG substrate and the electro-oxidation of methanol in aqueous sulfuric acid

Rodriguez-Nieto

Morante-Catacora

Cabrera

2004

Journal of Electroanalytical Chemistry

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Voltammetric comparison between platinum with preferred orientation and platinum single crystal electrodes

Cited by 22 publications

References 21 publications

Nanostructured platinum-on-carbon model electrocatalysts prepared by colloidal lithography

Nanostructured platinum-on-carbon model electrocatalysts prepared by colloidal lithography

Impedance Studies of Copper in Alkaline Solutions, Especially During Electroless Plating

Sequential and simultaneous electrodeposition of Pt–Ru electrocatalysts on a HOPG substrate and the electro-oxidation of methanol in aqueous sulfuric acid

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