2017 18th International Conference on Electronic Packaging Technology (ICEPT) 2017 Help me understand this report
Void risk prediction for Molded Underfill technology on flip chip packages
Search citation statements
Paper Sections
Select...
Citation Types
0
0
0
Year Published
2018
2021
Publication Types
Select...
2
1
Relationship
0
3
Authors
Journals
Cited by 3 publications
References 5 publications
0
0
0
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
