Here, the alpha amino
acid
l
-alanine is employed as both
a capping and stabilizing agent in the aqueous synthesis of submicron-sized
metallic copper particles under ambient atmospheric conditions. The
reduction of the copper(II) precursor is achieved using
l
-ascorbic acid (vitamin C) as the reducing agent. The nature of the
complex formed between
l
-alanine and the copper(II) precursor,
pH of the medium, temperature, and the relative proportion of capping
agent are found to play a significant role in determining the size,
shape, and oxidative stability of the resulting particles. The adsorbed
l
-alanine is shown to act as a barrier imparting excellent thermal
stability to capped copper particles, delaying the onset of temperature-induced
aerial oxidation. The stability of the particles is complemented by
highly favorable sintering conditions, rendering the formation of
conductive copper films at significantly lower temperatures (
T
≤ 120 °C) compared to alternative preparation
methods. The resulting copper films are well-passivated by residual
surface
l
-alanine molecules, promoting long-term stability
without hindering the surface chemistry of the copper film as evidenced
by the catalytic activity. Contrary to the popular belief that ligands
with long carbon chains are best for providing stability, these findings
demonstrate that very small ligands can provide highly effective stability
to copper without significantly deteriorating its functionality while
facilitating low-temperature sintering, which is a key requirement
for emerging flexible electronic applications.