Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse Imagery

Fu, Nianjun; Ahmed, Sudan; Suhling, Jeffrey C.; Lall, Pradeep

doi:10.1109/ectc.2017.333

Cited by 36 publications

(1 citation statement)

References 46 publications

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“…This shows that the stress/deformation occurs near the substrate as seen from the results of our simulation. Similarly, results obtained by Fu et al (2017) [45] and Pierce et al (2007) [46] shows comparable outcomes with high strain regions in the critical solder ball determined with FEM analysis and observation of the thermomechanical fatigue crack localised in the solder bulk on the component side.…”

Section: Strain Energy Simulation Results For Lead-based Eutectic Andsupporting

confidence: 81%

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Depiver

Mallik

Harmanto

et al. 2019

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

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Solder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system's operation often culminates in catastrophic failure of the device. The determination of creep damage in electronic component solder joint is vital to the prediction of crack initiation and prevention of premature failure. This paper presents the creep damage in solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB) and subjected to thermal cycling as well as isothermal ageing. ANSYS 19.0 package is employed to model the isothermal ageing at-40, 25, 75 and 150℃ temperatures for 45 days. Standard temperature cycle profile is used to simulate the effect of the coefficient of thermal expansion (CTE) mismatch on the bonded materials in the BGA component. The solders studied are lead-based eutectic solder alloy and lead-free SAC396, SAC387, and SAC305. Based on the results obtained for the stress, strain rate, deformation rate and strain energy of the solders, the research investigation advises on the most effective solder for achieving improvement in the thermo-mechanical reliability of solder joints in BGA soldered on PCB.

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Section: Strain Energy Simulation Results For Lead-based Eutectic Andsupporting

confidence: 81%

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Depiver

Mallik

Harmanto

et al. 2019

2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)

View full text Add to dashboard Cite

show abstract

Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment

Rajendran

Cho

Jung

2022

Materials Today Communications

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Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging

Ahmed

et al. 2018

2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

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Visualization of Microstructural Evolution in Lead Free Solders during Isothermal Aging Using Time-Lapse Imagery

Cited by 36 publications

References 46 publications

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Comparative study on the wettability and thermal aging characteristics of SAC 305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment

Quantification and Modeling of Microstructural Evolution in Lead Free Solders During Long Term Isothermal Aging

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