Visualization of electrochemical behavior in carbon steel assisted by machine learning

Localized Corrosion Occurrence in Low-Carbon Steel Pipe Caused by Microstructural Inhomogeneity

“…In Figure 6 a, pearlite has a lamella structure, and the surface potential of pearlite (A site) is approximately 44.4 mV higher than that of the surrounding pro-eutectoid ferrite (B site) in Figure 6 b and Table 5 . This indicates that the corrosion of pro-eutectoid ferrite is locally accelerated by microgalvanic corrosion between pearlite and the surrounding pro-eutectoid ferrite [ 19 , 24 ]. Figure 6 c,d show the correlation between cementite and ferrite in the pearlite by measuring topology and surface potential within a size of 2 μm × 2 μm, respectively.…”

“…Figure 6 d and Table 5 show that the surface potential of cementite in the pearlite (C site) is approximately 34.78 mV higher than that of ferrite in the pearlite (D site). Thus, the corrosion of ferrite is locally accelerated by microgalvanic corrosion between ferrite and cementite in the pearlite [ 19 , 24 ].…”

“…Accordingly, the carbon agglomerations occurred due to the high fractional presence of cementite in the pearlite. As shown in the AFM and KPFM analyses results ( Figure 6 and Table 5 ), when there are many pearlite phases, the material is vulnerable to corrosion due to microgalvanic corrosion between pearlite and surrounding pro-eutectoid ferrite, ferrite, and cementite [ 19 , 24 , 30 ]. The ferrite is corroded locally by microgalvanic corrosion around cementite.…”

“…The large fraction of pearlite has a higher corrosion rate due to microgalvanic corrosion between the surrounding pro-eutectoid ferrite and pearlite, and between cementite and ferrite in pearlite [ 19 , 24 ]. Due to the relatively accelerated corrosion rate of the large fraction of pearlite near the Al inclusions, the concentration of Cl − ions into Al vicinity and the accumulation of corrosion products are accelerated.…”

Galvanic corrosion inhibition from aspect of bonding orbital theory in Cu/Ru barrier CMP

“…The contact of two metals with different electrical potentials in an electrolyte induces galvanic corrosion 1 , 2 . Especially in the semiconductor manufacturing process, the galvanic corrosion issues are constantly being pointed out as the various metals such as copper (Cu), tantalum (Ta), aluminium (Al), tungsten (W), cobalt (Co), and ruthenium (Ru) are used in interconnect, a barrier layer (liner), via filling and bottom electrode applications depending on the technology node developed.…”