Virtual prototyping of PoP interconnections regarding electrically activated mechanisms

Meinshausen, L.; Weide‐Zaage, Kirsten; Frémont, Hélène; Feng, Wenlin

doi:10.1109/esime.2010.5464618

Cited by 6 publications

(7 citation statements)

References 12 publications

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“…The divergence of the mass flux is the scalar product of current density and temperature gradients. This means the mass flux divergence depends on the amount of these two vectors and the angle between them [1].…”

Section: Simulation Procedures and Model Descriptionmentioning

confidence: 99%

“…The dimensions of the traces are based on SEM analyses of the real PoP test structure. The materials were analyzed with energy dispersive X-ray spectroscopy (EDX) [1,19]. In figure 2 a SEM picture of the top part of the PoP package used as sample for the model is shown.…”

Section: Simulation Procedures and Model Descriptionmentioning

confidence: 99%

“…The electro-thermal and migration parameters are described in [1]. The values are taken from literature [8][9][10][11][12][13][14][15][16].…”

Section: Simulation Procedures and Model Descriptionmentioning

confidence: 99%

“…For the exploration of the stress distribution, the Von Mises Stress (VMS the change of the aspect ratio) was used. Comparisons between the simulation results, real aging test results [1], warpage analyses and additive simulation results being specialized for thermal mechanical calculations allowed a verification of the simulations.…”

Section: Introductionmentioning

confidence: 98%

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Underfill and mold compound influence on PoP aging under high current and high temperature stress

Meinshausen

Weide‐Zaage

Frémont

2010

3rd Electronics System Integration Technology Conference ESTC

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In consequence of the general densification of electronic components, the stress being submitted to the packages aggravates while the size of the internal interconnections shrinks. Against the background of an increasing reliability issue, this paper focuses on reliability aspects within PoP assemblies, submitted to high current and mechanical stress conditions. The role of underfill and molding compound (MC) on temperature management, migration phenomena and stress reduction in a ball grid array (BGA) was investigated. Therefore, thermal-electrical-mechanical finite element simulations were conducted using ANSYS ® and a model of a bump chain being common for PoP structures. With the results, migration mechanisms like electro-or thermo-induced migration in bumps were calculated.

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Section: Simulation Procedures and Model Descriptionmentioning

confidence: 99%

Section: Simulation Procedures and Model Descriptionmentioning

confidence: 99%

“…The electro-thermal and migration parameters are described in [1]. The values are taken from literature [8][9][10][11][12][13][14][15][16].…”

Section: Simulation Procedures and Model Descriptionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 98%

See 2 more Smart Citations

Underfill and mold compound influence on PoP aging under high current and high temperature stress

Meinshausen

Weide‐Zaage

Frémont

2010

3rd Electronics System Integration Technology Conference ESTC

Self Cite

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show abstract

“…The values for Cu 3 Sn and Cu-Sn were taken from literature [11]. Based on infrared observation in [12] and simulations [13] for the calculation of Q Ã a temperature gradients in order of 1 mK/lm will be used.…”

Section: Parameter Extractionmentioning

confidence: 99%