Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking

Barnat, Samed; Bellenger, Stephane; Frémont, Hélène; Gracia, A.; Talbot, Pascal

doi:10.1109/esime.2009.4938467

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2015

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Cited by 3 publications

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“…2) is a part of a system used for medical and veterinary applications for temperature measurements. This system is partly described in [12]. The WLCSP (Wafer Level Chip Size Package) is assembled on a flex substrate with solder balls, power supply is provided by two batteries, and some other surface mount components are also present on the flex.…”

Section: Test Vehicle Descriptionmentioning

confidence: 99%

Virtual prototyping in a Design-for-Reliability approach

Barnat¹,

Guédon-Gracia

Frémont

2015

Microelectronics Reliability

Self Cite

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Section: Test Vehicle Descriptionmentioning

confidence: 99%

Virtual prototyping in a Design-for-Reliability approach

Barnat¹,

Guédon-Gracia

Frémont

2015

Microelectronics Reliability

Self Cite

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“…The material of bump is lead free solder [4][5] at present. Recently, the wafer-level chip-scale packaging [6][7][8][9] is widely applied in highperformance ICs. Due to this effort and the redistribution layout (RDL) technique, the package size will not be larger than the chip size, as shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

A study to stencil printing technology for solder bump assembly

Wang

Hsieh

Huang

et al. 2009

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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In general, the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging) is able to be integrated by 7-step processes, including two masks and one set of stencil plate. After the formation of solder ball, the specified professional probe card is needed to verify whether the electric functions of this packaged IC are good. After this step, the wafer grinding, the wafer cutting, the chip choice and the final test (F/T) are gradually adopted to proceed. Finally, due to the customer's need, the shipping package type to customers is, generally, tray or tape and reel. Although the stencil printing technology can provide the mass-production capability, the mainly existing problems of this technology are the quality of manufacturing steel plate, the coating operation for solder paste, and the flatness of wafer surface. These issues usually constrain the minimization of the size of the solder ball and the pitch. Thinking to solve these issues, this package technology is still feasible in assembly competition.

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