Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques

A methodological approach for predictive reliability: Practical case studies

“…The following paragraphs will illustrate its different steps. Complete results can be found in [18]. The ultimate goal would be to establish a relationship between the calculated stress and the TTF, in order to be able, afterwards, to estimate a TTF only from calculated data.…”

Impact of ground solder ball failure in BGA package on near electric field radiation

“…They studied the changes of resistance before the failure occurrence of BGA assemblies using the both solder types. Berthou et al [19] described experimental and finite element model for BGA assemblies under vibration tests, which can evaluate reinforcement methods of large BGA submitted to vibrations. Sheng et al [20] studied the effects of different vibration directions on the damage mechanism of BGA under vibration loading coupled with cyclic thermal.…”