Vibration reliability characterization of PBGA assemblies

Yang, Qingjin; Pang, H.L.J.; Wang, Z.P; Lim, G.H.; Yap, Fook Fah; Lin, Rong

doi:10.1016/s0026-2714(00)00036-6

Cited by 51 publications

(23 citation statements)

References 9 publications

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“…18,19 To further understand the effect of TM additions on the microstructure and mechanical properties, in this study near-eutectic Sn-Ag-Cu-X (X 5 Ni, Co, and Zn) were prepared to investigate the relationships between solidification structure and thermal and tensile properties. Additionally, the vibration fracture resistance of solders is of importance when joints are assembled, e.g., in vehicles and aircraft, 20,21 and is apparently influenced by the microstructural features. Therefore, vibration tests were also performed to evaluate the effect of TM additions on the mechanical performance of Sn-Ag-Cu alloys.…”

Section: Introductionmentioning

confidence: 99%

Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys

Song

Huang

Chuang

2006

Journal of Elec Materi

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This study investigated microstructure, thermal behavior, and mechanical properties of Sn-3.3Ag-0.5Cu alloys (SAC) with the addition of transition metals (TM, Ni, Co, and Zn). Results show that alloying with TM elements was able to reduce the degree of undercooling and strengthen SAC alloys. Among these elements, only Zn can raise the ductility. CoSn and Cu-Ni-Sn intermetallics appeared, respectively, in the Co-containing and Ni-containing samples while coarse Sn dendrites and a large area of eutectic phases could be observed in the specimens with Zn. These microstructural changes led to an inferior vibration fracture resistance under resonant vibration with a constant pull force.

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Section: Introductionmentioning

confidence: 99%

Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys

Song

Huang

Chuang

2006

Journal of Elec Materi

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“…According to studies published by Yang et al (2000) and Wang et al (2004), cracks may occur in the solder joints and are highly depend on the type of fixation of the device and the risk of oscillation. However, these experiments were not conducted according to standards from the automotive industry.…”

Section: Advanced Requirements On Electronic Devicesmentioning

confidence: 99%

Reliability aspects of electronic devices for advanced requirements

et al. 2008

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Article information:To cite this document: Florian Schüßler, Michael Rösch, Johannes Hörber, Klaus Feldmann, (2008),"Reliability aspects of electronic devices for advanced requirements", Circuit World, Vol. Access to this document was granted through an Emerald subscription provided by FRIEDRICH ALEXANDER UNIVERSITAET ERLANGEN NUERNBERG For Authors: If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service. Information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comWith over forty years' experience, Emerald Group Publishing is a leading independent publisher of global research with impact in business, society, public policy and education. In total, Emerald publishes over 275 journals and more than 130 book series, as well as an extensive range of online products and services. Emerald is both COUNTER 3 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation.*Related content and download information correct at time of download. Reliability aspects of electronic devices for advanced requirements Florian Schüßler, Michael Rösch, Johannes Hörber and Klaus FeldmannInstitute for Manufacturing Automation and Production Systems, University of Erlangen-Nuremberg, Erlangen, Germany Abstract Purpose -This paper aims to detail the qualification of alternative substrate materials and reliability aspects for quad flat no lead (QFN) packages for highly stressed electronic devices, e.g. for use in automotive applications. Design/methodology/approach -Detailed information is given on the advanced climatic and mechanical requirements that electronic devices have to withstand during life cycle testing to qualify for the automotive industry. Studies on the suitability of high-temperature thermoplastics as substrate materials for printed circuit boards and the qualification of QFN packages for advanced requirements are described. In addition, information on causeeffect relationships between thermal and vibration testing are given.Findings -With respect to adhesion of metallization on high-temperature thermoplastics and the long-term stability of the solder joints, these substrate materials offer potential for use in electronic devices for advanced requirements. In addition, the long-term stability of the solder joints of QFN packages depends on the design of the landings on the PCB and the separation process of the components during manufacturing.Research limitations/implications -The paper covers only a selection of possible high-temperature thermoplastic materials that can be used in electronics production. Also, this paper has a focus on the new packaging type, QFN, in the context of qualification and automotive standards. Originality/value -The paper details the requirements electronic dev...

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“…An elastic plate, as the basic structural element, is widely used in engineering fields such as mechanical engineering [1,2] and in electronic equipments [3,4]. Its dynamic parametric solution can be used in system design optimization, fault diagnosis, reliability analysis, and system identification.…”

Section: Introductionmentioning

confidence: 99%

Fundamental frequency and testing mode of complicated elastic clamped-plate vibration

Guan

2008

Front. Mech. Eng. China

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Aimed at the modal analysis of complicated elastic clamped-plates, a trigonometric interpolation method of conformal mapping is applied to set up the mapping function between a complicated region and a unit dish region, and the fundamental frequency of the complicated vibrating region is analyzed with the help of the Galerkin method. Taking an elastic rectangle-plate with arc radius as an example, the testing mode frequency band of plates is determined by analyzing the fundamental frequency; meanwhile, according to hamming testing method of multi-point excitation to the single-point response, and by signal processing technology and its software programming, modal parameter recognition of the elastic clamped-plate is completed. Comparing the first order modal frequency with the theoretical fundament frequency, the validity of the testing mode method and theoretical analysis are verified.

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Vibration reliability characterization of PBGA assemblies

Cited by 51 publications

References 9 publications

Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys

Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys

Reliability aspects of electronic devices for advanced requirements

Fundamental frequency and testing mode of complicated elastic clamped-plate vibration

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