Very low loss multimode polymeric optical waveguides

Yoshimura, R.; Hikita, Makoto; Tomaru, Satoru; Imamura, Saburo

doi:10.1049/el:19970841

Cited by 25 publications

(8 citation statements)

References 2 publications

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“…4,5 Among the several techniques that can be applied to fabricate polymeric optical waveguide, dry etching method such as reactive ion etching (RIE) is often used because these techniques can offer excellent etching profile. [6][7][8] It has been thought that one of the disadvantages of this technique is its complicated process. Furthermore, this technique is not suitable to define large core dimensions (~ several 100 μm), which may be needed for optical applications such as interconnections.…”

Section: Introductionmentioning

confidence: 99%

Low-loss multimode waveguides using organic-inorganic hybrid materials

Yoon

2004

Macromol. Res.

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Multimode channel waveguides were fabricated using a direct UV patterning technology from thick films deposited by the one-step dip-coating of an organic/inorganic hybrid material (ORMOCER ® ). The core size of the covered ridge waveguide was 43 Ý51 μm 2 ; the waveguides can be readily prepared for multimode applications by direct UV patterning. The waveguides exhibited smooth surface profiles and a low optical loss of 0.07 dB/cm at the most important wavelength (850 nm) used for optical interconnects.

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Section: Introductionmentioning

confidence: 99%

Low-loss multimode waveguides using organic-inorganic hybrid materials

Yoon

2004

Macromol. Res.

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“…Several techniques can be applied to fabricate polymeric waveguides. [3][4][5] Among them, dry etching methods such as a reactive ion etching (RIE) and an inductively coupled plasma (ICP) are often used because this technique can offer the excellent etching profile. 6 One of the disadvantage of this technique is its complicated process, and thus, not cost effective for mass production.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of multimode polymeric waveguides by hot embossing process: Effect of sidewall roughness on insertion loss

Yoon

2004

Macromol. Res.

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We have fabricated a polymeric waveguide by using a hot embossing technique and have investigated its propagation loss. The replication of waveguide channels through the use of a hot embossing technique is of interest as a single-step process that could deliver surface roughnesses far smaller than the wavelength. We have evaluated experimentally that the sidewall roughness has a dominant effect on insertion losses of the multimode polymeric waveguide. The propagation loss of the waveguide decreased dramatically upon decreasing the sidewall roughness of the channel. We have confirmed that the preparation of waveguides having nanometer-scale sidewall roughness and 0.1 dB/cm propagation loss is possible when using the hot embossing technique.

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“…Film carriers controlling the characteristic impedance have been developed for optical transmission modules operating at several tens of gigahertz, since they have high-frequency transmission capability [4]. More recently, high-density optical guided wave films with high degrees of freedom in interconnection layout have been developed as interconnection media between the optical devices [5].…”

Section: Introductionmentioning

confidence: 99%

Optoelectronic chip on film (OE‐COF) packaging technology

Takahara

Ishibashi

Ishizawa

et al. 2002

Electron Comm Jpn Pt II

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SUMMARYAs a next-generation film carrier packaging technique intended for applications to high-speed large-capacity optical modules, OE-COF (Optoelectronic Chip on Film) packaging is proposed, in which LSIs and optical devices are installed on an optoelectronic compound film (OE film) by means of solder bumps. Its realizability is discussed. A 10-channel VCSEL of the 0.85-µm band with a 250-µm pitch is flip-chip mounted on an OE film by using thirty-six 80% Au-Sn solder bumps with a diameter of 40 µm. In regard to the basic configuration that couples an optical waveguide via a 45° mirror formed on the OE film, a mechanically strong flip-chip mounting of the VCSEL on an OE film and a low-loss optical coupling structure of the VCSEL and the OE film are discussed. As a result, a lowthermal-expansion OE film (11 × 10 -6

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Very low loss multimode polymeric optical waveguides

Cited by 25 publications

References 2 publications

Low-loss multimode waveguides using organic-inorganic hybrid materials

Low-loss multimode waveguides using organic-inorganic hybrid materials

Fabrication of multimode polymeric waveguides by hot embossing process: Effect of sidewall roughness on insertion loss

Optoelectronic chip on film (OE‐COF) packaging technology

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