1997
DOI: 10.1063/1.119074
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Very high (>1019 cm−3) in situ n-type doping of silicon during molecular beam epitaxy using supersonic jets of phosphine

Abstract: The use of supersonically injected pulses of phosphine to achieve uniform and high levels of n-type doping in Si during gas-source molecular beam epitaxy is demonstrated. Uniform n-type doping up to levels of 5×1019 cm−3 is obtained. SiGe/Si junction diodes made with this doping technique show good doping profiles and rectifying characteristics.

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Cited by 4 publications
(7 citation statements)
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“…These are the first experimental data that directly demonstrate the ability of supersonic jets to reduce the substrate temperature in thin film growth. Under similar conditions, growth on Si (111) substrates occurred at higher substrate temperatures and resulted in poorer crystalline quality than on Si(100). Energy enhancement was not investigated on Si (111).…”
Section: Silicon Carbidementioning
confidence: 87%
See 4 more Smart Citations
“…These are the first experimental data that directly demonstrate the ability of supersonic jets to reduce the substrate temperature in thin film growth. Under similar conditions, growth on Si (111) substrates occurred at higher substrate temperatures and resulted in poorer crystalline quality than on Si(100). Energy enhancement was not investigated on Si (111).…”
Section: Silicon Carbidementioning
confidence: 87%
“…Under similar conditions, growth on Si (111) substrates occurred at higher substrate temperatures and resulted in poorer crystalline quality than on Si(100). Energy enhancement was not investigated on Si (111).…”
Section: Silicon Carbidementioning
confidence: 87%
See 3 more Smart Citations