“…The fundamental mechanism for fabrication of porous Si centers around chemical etching [3,4], and while some studies have shown that ion irradiation prior to chemical etching can be used to control certain properties of porous Si [5,6], all porous Si fabrication processes use some combination of anodization or stain etching to produce the porosity in Si. In contrast, dense porous networks have been fabricated in many semiconductor materials, including Ge [7][8][9], GaSb [10][11][12], and InSb [13][14][15], purely by high-energy ion irradiation of the target material. These porous structures consist of interconnected networks of voids ranging in size from tens to hundreds of nanometers in diameter, and void growth and coalescence results in confinement of the matrix material into fibers or cell walls tens of nanometers in thickness.…”