2016
DOI: 10.1021/acs.chemmater.6b01595
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Vertically Aligned and Interconnected Graphene Networks for High Thermal Conductivity of Epoxy Composites with Ultralow Loading

Abstract: Efficient removal of heat via thermal interface materials has become one of the most critical challenges in the development of modern microelectronic devices. However, traditional polymer composites present limited thermal conductivity even when highly loaded with highly thermally conductive fillers due to the lack of efficient heat transfer channels. In this work, vertically aligned and interconnected graphene networks are first used as the filler, which is prepared by a controlled three-step procedure: forma… Show more

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Cited by 328 publications
(183 citation statements)
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“…With advances in nanoelectronics and the emergence of new application areas, such as 3D chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials to help address the pressing thermal management challenges . The current materials for dissipating heat in electronic devices are mainly polymer‐based composites, due to their ease of processing, light weight, and low cost . In many cases, the insulating property of thermal management materials is critically important because they play a role of electrical insulators.…”
Section: Introductionmentioning
confidence: 99%
“…With advances in nanoelectronics and the emergence of new application areas, such as 3D chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials to help address the pressing thermal management challenges . The current materials for dissipating heat in electronic devices are mainly polymer‐based composites, due to their ease of processing, light weight, and low cost . In many cases, the insulating property of thermal management materials is critically important because they play a role of electrical insulators.…”
Section: Introductionmentioning
confidence: 99%
“…Traditional ways to form thermally conductive network usually require a high loading of filler which would exert bad influence on the overall performance of composites. One approach to address this issue was to use graphene aerogel as a free standing filler framework and heat transfer medium, which has already been proposed by lots of scholars . The graphene aerogel with continuous 3D network was infiltrated by thermally insulating polymer matrix to achieve a highly thermally conductive polymeric based composite.…”
Section: Introductionmentioning
confidence: 99%
“…The value was hardly obtainable using traditional methods of commercially available graphene . Lian et al infiltrated epoxy resin into aerogel which was vertically aligned. Comparing with pure epoxy matrix, the TC value of the composite reached 2.13 W m −1 K −1 at a filler fraction of 0.92 vol%, which was enhanced by 1,231%.…”
Section: Introductionmentioning
confidence: 99%
“…[4][5][6][7][8][9][10][11] For instance, it has been reported that NG sheets have a thermal conductivity of 100-2000 W m −1 K −1 in the (002) crystal plane. [13][14][15][16][17] www.advmatinterfaces.de process required sophisticated equipment or special treatment of the fillers. [13][14][15][16][17] www.advmatinterfaces.de process required sophisticated equipment or special treatment of the fillers.…”
Section: Introductionmentioning
confidence: 99%