2023
DOI: 10.1016/j.vacuum.2022.111650
|View full text |Cite
|
Sign up to set email alerts
|

Vertical sidewall of silicon nitride mask and smooth surface of etched-silicon simultaneously obtained using CHF3/O2 inductively coupled plasma

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2023
2023
2024
2024

Publication Types

Select...
6

Relationship

0
6

Authors

Journals

citations
Cited by 6 publications
(1 citation statement)
references
References 52 publications
0
1
0
Order By: Relevance
“…At certain recipe parameters (e.g., gas flow, RF power, supplementary gases content, etc. ), this layer efficiently passivates the walls of the etching pits but still allows vertical etching of the materials. , CHF 3 -based etching used here produces arbitrary patterns in MoS 2 flakes (including circular holes) with a minimal undercut. Hence it is more versatile compared to SF 6 -based plasma, which inevitably combines vertical and anisotropic in-plane etching of TMDs .…”
Section: Resultsmentioning
confidence: 99%
“…At certain recipe parameters (e.g., gas flow, RF power, supplementary gases content, etc. ), this layer efficiently passivates the walls of the etching pits but still allows vertical etching of the materials. , CHF 3 -based etching used here produces arbitrary patterns in MoS 2 flakes (including circular holes) with a minimal undercut. Hence it is more versatile compared to SF 6 -based plasma, which inevitably combines vertical and anisotropic in-plane etching of TMDs .…”
Section: Resultsmentioning
confidence: 99%